Refurbished Chemical Mechanical Polisher Tool

**** Please review attached Solicitation document for full details on this requirement ****

THIS IS A COMBINED SYNOPSIS/SOLICITATION FOR COMMERCIAL ITEMS PREPARED IN ACCORDANCE WITH THE FORMAT IN FAR SUBPART 12.6-STREAMLINED PROCEDURES FOR EVALUATION AND SOLICITATION FOR COMMERCIAL ITEMS-AS SUPPLEMENTED WITH ADDITIONAL INFORMATION INCLUDED IN THIS NOTICE. THIS ANNOUNCEMENT CONSTITUTES THE ONLY SOLICITATION; QUOTATIONS ARE BEING REQUESTED, AND A WRITTEN SOLICITATION DOCUMENT WILL NOT BE ISSUED. THIS SOLICITATION IS BEING ISSUED USING SIMPLIFIED ACQUISITION PROCEDURES UNDER THE AUTHORITY OF FAR 13.5 TEST PROGRAM FOR CERTAIN COMMERCIAL ITEMS.

This solicitation is a request for quotation. The solicitation document incorporated provisions and clauses are those in effect through Federal Acquisition Circular (FAC) 2005-92-1, effective December 19, 2016.

1352.215-72 INQUIRIES (APR 2010)
Offerors must submit all questions concerning this solicitation in writing, via email, to both the Contract Specialist (forest.crumpler@nist.gov) and the Contracting Officer (Patrick.staines@nist.gov). Questions shall be received no later than seven (7) calendar days after the issuance date of this solicitation.
All responses to the questions will be made in writing, without identification of the questioner, and will be included in an amendment to the solicitation. Even if provided in other form, on the question responses included in the amendment to the solicitation will govern performance of the contract. (end of provision)
The associated North American Industrial Classification System (NAICS) code for this procurement is 333242 with a small business size standard of 1,500 employees or less.
This acquisition is 100% set-aside for small business.
BACKGROUND

The National Institute of Standards and Technology (NIST) requires the purchase of one Chemical Mechanical Polisher (CMP) to support nanofabrication in the Center for Nanoscale Science and Technology (CNST), NIST's nanotechnology user facility. The CMP tool will be sited and used in the CNST NanoFab as a shared resource accessible to researchers from industry, academia, NIST, and other government agencies.

GENERAL DESCRIPTION

A CMP tool is a stand-alone piece of equipment used to remove topography on wafers and substrates using a combination of chemical action from a liquid slurry and mechanical action form a polishing pad.
It can be thought of as a nanoscale "grinder", where the wafer and polishing pads are in contact under a few psi of pressure and rotating together a slightly different speeds, while the wafer also oscillates horizontally. Typically, this technology produces a sub-nanometer surface roughness as defined by the RMS value.

This requirement is for a refurbished model CMP tool, and not new equipment.
All offerors shall provide a firm fixed price quotation for the following line items:
LINE ITEM 0001: Quantity One (1) refurbished Chemical Mechanical Polisher (CMP) Tool to meet the MINIMUM SPECIFICATIONS detailed below:
1. The tool shall be a refurbished piece of equipment, restored to an "as new" condition with the following items completed at a minimum.
i. Install new platen housings, bearings and races.
ii. Install new polish arm bearings and races.
iii. Install new or reprocessed platens, Teflon-coated and lapped
iv. Install new slurry pumps
v. Replace all valves, manifolds, tubing, and all parts having handled slurry chemistries in the past.
vi. Clean and paint frame if original shows signs of wear or corrosion
vii. New power supplies
viii. New flat control panel
ix. Replace original high torque motors
x. Replace original hard drive with solid state drive

2. The tool shall support wafer sizes of 3", 4", 6" and 8".
3. The tool shall be equipped with two polishing platens: one for primary polish and one for final "buff" polish.
i. The primary pad shall be fitted with an IC1000 polishing pad or equivalent.
ii. The final polish pad shall be equipped with a Polytex polishing pad or equivalent.
iii. Platen rotation speed: 10-175 rpm
4. The tool shall be equipped with an endpoint detection (EPD) system.
i. The EPD system shall monitor the polishing platen motor current
ii. The motor current shall be used to detect transitions between layers
iii. The EPD software shall allow algorithm development
iv. The EPD software shall allow configuring and assigning recipes to polish recipes
5. Each of the two platens shall be equipped with two slurry dispensing heads.
i. Slurry flow rate: 100 ml/min-1000 ml/min
6. The polish head shall be capable of rotating and oscillating.
7. The tool shall be set up for cassette-to-cassette wafer handling for 4" and 6" wafers.
8. The tool shall be capable of in-situ pad conditioning
9. The tool shall be equipped with a polish head clean station
10. The tool shall be equipped with a water reduction and filtration system to minimize water usage while maintaining the polishing pads wet during idle periods.
11. The water reduction system shall be equipped with an idle-detect feature to trigger the system
12. The water reduction system shall be equipped with a timer to control the periodic flush and refills
13. The tool shall be equipped with membrane wafer carriers for all wafer sizes in order to provide uniform pressure to the backside of the wafer, and reduce the total thickness variation (TTV) when removing large amounts of material.
i. Rotation speed: 10-125 rpm
14. The wafer carriers shall provide dual-zone pressure control to ensure wafer flatness during polish.
i. Membrane pressure: 0.5-7 psi
15. The wafer carriers shall be equipped with a pressurized retaining ring in order to reduce the edge exclusion zone.
i. Ring pressure: 0.5-7 psi
16. The system shall meet all SEMI S2 safety standards
17. Process Capability: The CMP tool shall be capable of achieving a Within Wafer Uniformity (WIWU) and Wafer-to-wafer Uniformity (WTWU) as stated below:
I. WIWU: Sigma/mu ≤ 3 % for each of the 5 wafers
II. WTWU: [max(mu)-min(mu)]/mean (mu) ≤ 5 % across the 5 wafers

LINE ITEM 0002: Quantity One (1) Lot, set of spare parts, to include at a minimum, the following:
1. Slurry tubing
2. O-rings
3. Pressure sensors
4. Proximity sensors
5. Fiber optic amplifier
6. Regulators
7. Pumps
8. Valves
9. Spacers
10. Wafer retaining rings
11. Membranes

LINE ITEM 0003: Quantity One (1) lot, Training:
The vendor shall provide on-site operation and maintenance training immediately following installation, consisting of 3 business days of application engineering and 2 business days of basic operation and maintenance training immediately following installation
a. WIWU: Sigma/mu ≤ 3 % for each of the 5 wafers
b. WTWU: [max(mu)-min(mu)]/mean (mu) ≤ 5 % across the 5 wafers.

The Technical Point of Contact will contact the Contractor to schedule the training immediately upon completion of installation by the Government.