one (1) 3D Laser Lithography System for three dimensional micro and nanofabrication.
Award Notice Posted
- Solicitation number
- W911QX-17-T-0269
- Agency
-
ACC Aberdeen Proving Ground
Army Contracting Command, Department of Defense
- Awarded
- to Nanoscribe Holding GMBH
- Set-aside
- No set-aside
Opportunity facts
- Contract number
- W911QX17P0315 Federal contract award
- NAICS code
- 333242 Semiconductor Machinery Manufacturing
- PSC
- Not on record
- Place of performance
- 2800 Powder Mill Rd Adelphi, Maryland 20783, United States
Notice details come from SAM.gov. Updated .
Notice text
Synopsis - J&A for Other than Full and Open Competition
1. Class Code: 6640
2. NAICS Code: 333242
3. Subject: NOTICE OF INTENT TO SOLE SOURCE - one (1) 3D Laser Lithography System for three dimensional micro and nanofabrication.
4. Solicitation Number: W911QX-17-T-0269.
5. Set-Aside Code: N/A
6. Response Date: 8/24/2017
7. Place of Performance: US Army Contracting Command - Aberdeen Proving Ground
Adelphi Contracting Division
2800 Powder Mill Road
Adelphi, Maryland 20783
8. Description:
The United States Government intends to solicit and negotiate with only one source under the authority of 10 U.S.C 2304(C) (1) as implemented by FAR13.501(a); One Responsible Source and No Other Supplies or Services Will Satisfy Agency Requirements - based on the system needing to meet the Government's minimum specifications as listed below:
• One (1) 3D Laser Lithography System for three dimensional micro and nanofabrication that is capable of three dimensional additive engineering and two dimensional mask less lithography with feature sizes ranging from 200 nm to three (3) mm, printing of structure heights beyond the working distance of objectives and the ability to write in two different modes.
The Government intends to solicit and negotiate with Nanoscribe GmbH Hermann-von-Helmoholtz-Platz 1 Eggenstein - Leopoldshafen, Baden-Württemberg, 76344 , Germany for one (1) 3D Laser Lithography System for three dimensional micro and nanofabrication as they are the only vendor who can meet the Government's minimum requirement. This notice of intent is not a request for competitive proposals. However, any responsible source who believes it is capable of meeting the requirement may submit a capability statement, proposal, or quotation, which shall be considered by the agency, only if received by the closing date and time of this notice. A determination not to compete the proposed requirement based upon the responses to this notice is solely within the discretion of the Government.
Responses to this notice are due on or before 8/24/2017 by email at Joshua.d.lenfest.civ@mail.mil
Point of Contact for this notice is Joshua Lenfest Contract Specialist at 301-394-0755 or Joshua.d.lenfest.civ@mail.mil
1. Requirements: 3D Laser Lithography System-The Contractor shall deliver quantity one (1) 3D Laser lithography system for true three-dimensional micro and nanofabrication that meets the specification described in Section 1.1 through 1.7 below.
1.1 The 3D Laser lithography system shall be capable of processing substrates listed in Table 1 according to the corresponding specifications.
Table 1: Sample Processing Specifications
Lateral Sample Dimensions Sample Thickness Range Materials
Square
125 milimeters (mm) x 125 mm Up to 2.2 mm Glass substrates, Silicon
Square
25 mm x 25 mm Up to 0.7 mm Glass Substrates, Silicon
Rectangle
45 through 76 mm x 19 through 26 mm Up to 1.0 mm Glass substrates
Circle
Diameter 11 mm to 25.4 mm Up to 0.3 mm Glass substrates, Silicon
Circle
Diameter 30 mm Up to 0.17 mm Glass substrates
1.2 The Contractor shall ensure that the 3D Laser Lithography system is a fully functional 3D printer as well as 2D mask less direct writer in the micrometer and nanometer scale with the following components and capabilities:
• Ultra fast galvo scanner based scan head with scanning control unit and analog control to provide rapid x-y scanning for two photon polymerization with position accuracy better than two (2) micrometers (um).
• Piezo stage for arbitrary 3D trajectories and true three dimensional shapes including helices, micro rings, bichiral structures etc.
• A motorized stage mounted on a microscope with integrated camera, LED lighting for identification of region of writing and manual alignment relative to markers, including operations of rotation and stretching.
• Motorized scanning stage with writing field of up to 100 x 100 milimeters squared (mm2).
• Microscope objective enabling sharp laser focus in order to achieve feature sizes of 160 nanometers (nm) in the XY plane for 2D patterning and 200 nm for 3D patterning.
• Active self leveling isolation frame with optical breadboard.
• Pulsed fiber near infrared (IR) femto-second laser system with a wavelength of 780 nm
o high repetition rate and stability repetition rate 80 megahertz (MHz) +/- one (1) MHz
o Beam Qulaity factor (M2) < 1.2
o Pulse Length < 120 femto seconds (fs)
o Average Laser Power > 120 megwatts (mW)
• High sensitivity microscope camera:
o 1388 pixel horizontal (H) x 1038 pixel vertical (V) = 1.4 megapixel
o color; 4.65 um x 4.65 um
• System control software and autofocus with automatic recognition of the interface between substrate and photoresist.
1.3 The Contractor shall ensure that the 3D laser Lithography system is equipped with a user friendly software package and compatible with Autodesk Inventor, SolidWorks and 123D CAD. In addition the system should have the following capabilities:
• Tool software should be able to convert DXF and STL files to the native software format.
• Automatically repair, slice and hatch imported STL files according to users' settings and based on 3D visualization.
1.4 The Contractor shall ensure that the 3D Laser Lithography system provides a choice of substrate holders and substrates (glass substrates with and without conductive Indium Tin Oxide, Fused Silica) for both printing modes namely Dip-in-Laser Lithography (DiLL) and oil immersion.
1.5 The Contractor shall ensure that the 3D Laser Lithography system is compatible with a variety of objectives (immersion and air) capable of printing high resolution 200 nm feature sizes to faster writing speed 2D maskless lithography.
1.6 The Contractor shall ensure that the 3D Laser Lithography system provides a selection of photopolymer resins optimized for 2- Photon Polymerization (2PP) process and capable of working with other commercially available photoresists such as AZ resists, SU-8 etc.
1.7 Warranty
The Contractor shall provide a full warranty on the 3D Laser Lithography System , which shall be included within the Contract Award, for one (1) year after onsite tool acceptance. The Contractor shall ensure the warranty includes:
• Installation and replacement of all parts (excluding consumable parts and materials) at no additional cost to the Government.
• All repairs or modifications if the Laser Writer System is no longer functional according to the acceptance test specifications at no additional cost to the Government.
• All labor and transportation costs to and from ARL for repairs and modification at no additional cost to the Government.
• A response time of 48 hours from the time the Government calls or emails in a request for service to diagnose and propose a plan to repair the 3D Laser Lithography System
• Commencement of repair activities within 96 hours of receiving the Government's call or email for service
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