NGMM Shopping Notice

The Defense Advanced Research Projects Agency (DARPA) issued Shopping Notice DARPA-SN-26-69 on April 16, 2026, soliciting innovative solutions for the Next-Generation Microelectronics Manufacturing (NGMM) program through the DARPA Expedited Research Innovation System (ERIS) marketplace. This active and immediate search targets post-competitive, awardable solutions that exercise the early-stage NGMM 3D Assembly Design Kit (3D-ADK) for mixed-material 3D-heterogeneously integrated (3DHI) microsystem design utilizing commercial Electronic Design Automation (EDA) tools. The review period extends from April 16 through July 31, 2026, with the government reserving the right to make awards on a rolling basis prior to the closing date. The Microsystems Technology Office (MTO) aims to address current limitations in existing EDA tools and infrastructure that are insufficient for efficient 3DHI design simulation and verification.

Prospective contractors must submit solutions that comprehensively exercise the 3D-ADK and EDA workflow to support architectural trade studies and verify design functionality through the sign-off phase. Desired qualifications include demonstrated expertise in mixed-signal and mixed-materials design using multi-physics EDA tools, proven experience with compound semiconductors and multiple foundries, and designs featuring two to three vertically integrated component layers leveraging NGMM center offerings with materials such as Si, glass, GaN, InP, GaAs, SiC, and yttrium iron garnet. Existing awardable solutions should be submitted via email to ERIS@darpa.mil with the subject line "Shopping Notice Response: DARPA-SN-26-69 - [Company Name]," while new submissions must be uploaded to the Strategic Systems Topic Area through the DARPAConnect ERIS Portal using the specified video title format. All solutions are evaluated against standard ERIS Master Solicitation criteria, and solutions deemed awardable will be considered for NGMM funding, with preference given to proposals demonstrating defense and dual-use applications.