Common Heterogeneous Integration and IP Reuse Strategies (CHIPS)
Awarded Award Notice Posted
- Solicitation number
- DARPA-BAA-16-62
- Agency
- Defense Advanced Research Projects Agency Department of Defense
- Awarded
- Set-aside
- No set-aside
Opportunity facts
- NAICS code
- 541712 Research and Development in the Physical, Engineering, and Life Sciences (except Biotechnology)
- PSC
- Not on record
Notice details come from SAM.gov. Updated .
Notice text
3 versions
Update #3 · Latest ·
Added: Sep 29, 2016 11:24 am
Modified: Dec 21, 2016 10:40 amTrack Changes
Amendment 02: The purpose of this amendment is to add a header to the Full Proposal Format section. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document.
Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document.
Original Synopsis Below.
The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
Update #2 ·
Added: Sep 29, 2016 11:24 am
Modified: Nov 22, 2016 2:40 pmTrack Changes
Amendment 01: The purpose of this amendment is to update the Proposal Due Date and FAQ Deadline. See the changes as highlighted in yellow in the attached conformed DARPA-BAA-16-62 document.
Original Synopsis Below.
The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
Update #1 ·
Added: Sep 29, 2016 11:24 am The Common Heterogeneous Integration and Intellectual Property (IP) Reuse Strategies (CHIPS) program will develop the design tools and integration standards required to demonstrate modular integrated circuit (IC) designs that leverage the best of DoD and commercial designs and technology.
Attachments
| File | Type | Posted |
|---|---|---|
| DARPA-BAA-16-62-Amendment-02.pdf | ||
| DARPA-BAA-16-62-Amendment-01.pdf | ||
| DARPA-BAA-16-62.pdf | ||
| DARPA-BAA_16-62_Attachment_1_Proposer_Checklist.pdf | ||
| DARPA-BAA-16-62_Attachment_2_Proposal_Summary_Chart_CHIPS.pptx | PPTX presentation |
Notice history
| Notice | Type | Posted |
|---|---|---|
| Common Heterogeneous Integration & IP Reuse Strategies Support Technologies | Award Notice | |
| Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) | Award Notice | |
| Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) | Award Notice | |
| Common Heterogeneous Integration and IP Reuse Strategies (CHIPS) | Award Notice |
And 1 more award notice.
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