DARPA-BAA-16-62_Attachment_2_Proposal_Summary_Chart_CHIPS.pptx

Distribution Statement Follow the general guidance in each of the following quadrants.

Provide a concise and informative summary of your proposal.

Unclassified information only.

Maximum of one slide.

Include images and figures where appropriate.

Please submit in MS PowerPoint (preferred) or equivalent file format.

Guidance for CHIPS proposal summary slide

Interface Standard(s) Proposal and Rationale Team organization, cost, milestones and schedule Innovative Claims and Technical Approach(es) What is the problem? Why is the solution challenging?

How is it done today, and what are the limits of current practice?

What is unique about your approach? Why will it succeed? Articulate your objectives using absolutely no jargon.

What are the major technical risk elements and how do you plan to address/mitigate them?

Include a graphic that summarizes the proposed effort if supportive.

What interface standard or standards are you proposing?

What is the rationale for the interface standard(s) selection?

What are the pros and cons of the proposed interface standard(s) compared to alternatives?

What are the risk related to the proposed interface standard(s)?

Show the proposed team organization, cost, technical milestones (intermediate and end-of-phase milestones), and project schedule.

List the proposed deliverables: data, reports, software, simulations, prototype components, test results, etc.

Technical Area Which technical area does this proposal address?

List the proposed performance goals and timeline as quantitative metrics.

Who are the potential technology transition partners within the DoD?

How does the proposed effort improve DoD’s ability to leverage advanced commercial semiconductor technology?

SOURCE SELECTION SENSITIVE – SEE FAR 2.101 AND 3.104

Abstract or Proposal Title (CHIPS TA1 or TA2) Proposing organization | Principal Investigator | Total budget | List of subcontractors

Technical Rationale and Approach(es) Team organization, cost, milestones and schedule Innovative Claims What is the problem? Why is the solution challenging?

How is it done today, and what are the limits of current practice?

What is unique about your approach? Why will it succeed?

Include a graphic that summarizes the proposed effort if supportive.

What are you trying to do? Articulate your objectives using absolutely no jargon.

Outline clearly how you plan to accomplish technical goals and program metrics stated in the BAA.

What are the fundamental performance vs. SWaP trade-offs?

What enabling technology is needed for this technology approach? Is it currently available, commercial off the shelf?

What are the major technical risk elements and how do you plan to address/mitigate them?

Include a figure that captures the technical approach if supportive.

Document which interface or interfaces you anticipate supporting if appropriate.

Show the proposed team organization, cost, technical milestones (intermediate and end-of-phase milestones), and project schedule.

List the proposed deliverables: data, reports, software, simulations, prototype components, test results, etc.

Technical Area Which technical area does this proposal address?

List the proposed performance goals and timeline as quantitative metrics.

Who are the potential technology transition partners within the DoD?

How does the proposed effort improve DoD’s ability to leverage advanced commercial semiconductor technology?

SOURCE SELECTION SENSITIVE – SEE FAR 2.101 AND 3.104

Abstract or Proposal Title (CHIPS TA3) Proposing organization | Principal Investigator | Total budget | List of subcontractors image2.png image4.png