Precision_Milling-Polishing_System.pdf

PRODUCT DESCRIPTION

ALLIED HIGH TECH X-PREP® PRECISION

MILLING/GRINDING/POLISHING SYSTEM

The Protective Technologies Laboratory has the requirement for the acquisition of a X-Prep® Precision Milling/Grinding/Polishing System from Allied High Tech Products, Inc. of Rancho Dominguez, California, or its functional equivalent. The proposed system shall be configured as follows:

Part # Description Qty 15-9550 X-Prep Milling/Grinding/Polishing System, 100-125V AC, 50-60 Hz, to include:

2” Capacity Fixture 1 Polishing Applicator 1 2 Year Warranty 1 15-9171 3D Software module for X-Prep® with Direct Connect, to include 1 3D Software Module 1 Mini-PC, to include: 1 Windows OS, software license for Communication and

MS Excel, monitor, keyboard, and mouse

15-50100 X-Prep® Vision™ 100 – Substrate Measurement Instrument, 100-

240V AC

15-5100 Visible Light Spectrometer for X-Prep® Vision™ 1 15-92ASSORT Assortment Starter Tool/Consumables Kit for X-Prep®, to include: 1 End Mills – Solid Carbide

15-924FS0.7 0.7mm Ø 4-Flute (Fe/Al/Cu) (Pk/4) 1 15-924FS1.0 1 mm Ø 4-Flute (Fe/Al/Cu) (Pk/4) 1 15-924FS1.5 1,5 mm Ø 4-Flute (Fe/Al/Cu) (Pk/4) 1 15-924FS2.0 2 mm Ø 4-Flute (Fe/Al/Cu) (Pk/4) 1 15-924FS3.0 3 mm Ø 4-Flute (Fe/Al/Cu) (Pk/4) 1 15-924FP3.0 3 mm Ø 4-Flute (PCB) (Pk/4) 1

Diamond Tools, Metal Bond – Solid Carbide 15-92FMB0.7 0.7 mm Ø Fine (Pk./2) 2 15-92FMB1.0 1 mm Ø Fine (Pk./2) 2 15-92FMB1.5 1.5 mm Ø Fine (Pk./2) 2 15-92FMB2.0 2 mm Ø Fine (Pk./2) 1 15-92FMB3.0 3 mm Ø Fine (Pk./2) 1

Plated Diamond Tool 15-92CP1.5 1.5 mm Ø Course (Pk/4) 1

Diamond Grinding Discs 15-92FGD5 FINE, 5mm Ø (Pk/100) 1

Polishing Tools 1 mm Ø polishing mounts 5

1.5 mm Ø polishing mounts 5 2 mm Ø polishing mounts 5 3 mm Ø polishing mounts 5 5 mm Ø polishing mounts 5

1 mm Ø Disposable Punches 10

1.5 mm Ø Disposable Punches 10 2 mm Ø Disposable Punches 10 3 mm Ø Disposable Punches 10 5 mm reusable punch, disc-punch mat, cloth tool-making guide

Sample Pads – 2”x2” plain-back of the following:

ChemPol, Planar Pad, Final-POL, DiaMat, X-Pad II, Final X

LocTite 460 & 454® Super Glue Adhesive 1 320 Grit Silicon Carbide Paper, 8” Disc 1

Polishing Supplies 30 µm Diamond compound, Polycrystalline, 5 g syringe 1 15 µm Diamond compound, Polycrystalline, 5 g syringe 1 9 µm Diamond compound, Polycrystalline, 5 g syringe 1 6 µm Diamond compound, Polycrystalline, 5 g syringe 1 1 µm Diamond compound, Polycrystalline, 5 g syringe 1

15-92XL32 X-Lube Cutting-Grinding-Polishing Fluide, 32 oz 4 180-25015 0.4 µm Colloidal Silica Polishing Suspension, 16 oz 1

15-9125 Fixture for X-Prep®, 2”x2” Capacity, to include 1 15-9126 Borosilicate Glass Inserts, 2”x2”x1/8”T (Pk/20) 1

180-25015 0.04 µm Colloidal Silica Polishing Suspension, 16 oz 1 15-9135 Fixture for X-Prep®, 3”x3” Capacity, to include: 1

15-9136 Borosilicate Glass Inserts, 3”x3”x1/8”T (Pk/20) 1 180-25015 0.04 µm Colloidal Silica Polishing Suspension, 16 oz 1

15-9140 Fixture for X-Prep®, 4”x4” Capacity, to include: 1 15-9148 Borosilicate Glass Inserts, 4”x4”x1/8”T (Pk/20) 1

71-10040 Mounting Wax, Clear, 50 g stick 1 15-9151 Fixture for X-Prep®, 4.5”x6” Capacity, to include: 1

15-9148 Borosilicate Glass Inserts, 4”x6”x1/8”T (Pk/20) 1 71-10040 Mounting Wax, Clear, 50 g stick 1

15-9157 Wafer Holding Fixture, 150 mm Ø x 3 mm T, X-Prep®, to include 1 Borosilicate glass support discs for mounting 150 mm Ø wafers 10

15-9120 Digital Indicator Measurement System with Granite Stand 1 15-9180 Dust extraction system for X-Prep®, 115V AC, to include 1

Filter Bag 2 Micro-filter

The salient features of the X-Prep® system as configured above, and associated optional instruments, are as follows:

• Capable of milling both integrated circuit packaging (including plastic encapsulants, metal lids, and ceramic packages), as well as the enclosed semiconductor devices.

• Key performance parameters:

i) Processing uniformity of ±3 µm over 100mm x 100 mm semiconductor surface

ii) 100 mm travel in X and Y axes

iii) X/Y milling rate from 0.1mm/sec to 20mm/sec

iv) Convex and concave semiconductor profile deprocessing

• Support for automated unattended processing:

i) Non-contact measurement of thickness remaining from 15 nm to 1 mm

(1) Support for single-point measurements and multi-point scan measurements

(2) Allowable surface roughness of up to 15 µm

ii) Closed loop control of:

(1) X/Y axis position (1 µm resolution)

(2) Z axis position (0.1 µm resolution, 1 µm accuracy)

(3) Z-axis force control (0.5N to 10N), in three modes:

(a) Constant depth with changing force (for milling)

(b) Constant force to specified depth (for milling)

(c) Constant force with changing depth (for polishing)

iii) Automatic Z-axis tool advancement with coordinated X/Y movement

iv) Automatic tool bit exchange

v) Automatic parallel sample leveling to X/Y tool plane

(1) Tolerance controllable for 0.5 µm to 100 µm

(2) Dual-axis control of sample leveling

(a) 0.5 µm resolution

(b) 1 µm uniformity over 100 mm

vi) Ethernet connection for system control and output

vii) Available application programming interface for user-defined measurement and automatic operations

• Health and Safety

i) Safety interlock on hood to prevent user access to cutting surface when system is active.

• Other

i) Real-time video display for sample imaging