SATPC0032515 Tab 04 4 SOW..pdf
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- Printed Circuit Board (PCB) Fabrication and Assembly for Lunar Inverter Breadboard Prototype
- Solicitation number
- 80NSSC23844720Q
About this file
This document provides the statement of work for a federal contract solicitation seeking printed circuit board fabrication and assembly services. The National Aeronautics and Space Administration Shared Services Center is soliciting proposals to produce 48 each of 10 different printed circuit boards for a lunar inverter breadboard prototype. The statement of work specifies the fabrication and assembly requirements for the printed circuit boards, including design files, board specifications, material and process specifications, and assembly requirements. Proposers must comply with IPC-6012 and IPC-A610 standards and any deviations from the requirements must be confirmed with the procurement team.
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| File | Type | Posted |
|---|---|---|
| SATPC0032515 Tab 07 Capability Statement SAM.gov.pdf |
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Text version
Required are the printed circuit boards with properties listed in Table 1. General fabrication and assembly requirements are listed in Table 2. Other necessary fabrication and assembly information (Gerbers, NC Drill files, Pick and Place coordinates, BOM) can be found in the PR package. The vendor must comply with IPC‐6012 class 2 and IPC‐A‐610 class 2 specifications.
Minor requirement deviations may be acceptable. Part substitutions may be acceptable. Please confirm any deviations with the procurement team.
Table 1: Listing of individual PCBs
Board Doc Num Fab Qty Assembly Qty Rev Layers Length (in)
Breadth (in)
Holes Special Requests
Power 999921ERP001 48 48 B 6 6.500 4.000 243 2 oz copper, all layers
Driver 999921ERP002 48 48 A 4 6.500 3.500 89 x
Output Filter 999921ERP003 48 48 C 2 6.500 3.750 121 x
VI Sense 999921ERP004 48 48 B 2 6.500 3.890 127 x
Relay 999921ERP005 48 48 B 2 6.500 3.750 62 x
Controller 999921ERP006 48 48 A 6 6.500 3.750 412 x
DC Switch 999921ERP008 48 48 B 2 4.610 3.735 106 2 oz copper, all layers
DC Switch Controller 999921ERP009 48 48 A 4 4.590 3.345 155 x
Backplane 999921ERP010 16 16 B 4 15.000 2.200 413 x
Blank Backplane 999921ERP016 16 0 A 2 15.000 2.200 17 x
Table 2: General fab and assembly requirements
Specification Value Specification Value Material FR4 – lead free Finished Thickness 0.062 inches +/‐ 10% Surface Finish ENIG Copper Thickness (unless otherwise noted) 1 oz
Minimum hole size > 0.010 inches Minimum Trace/Space Width (all layers) 0.006 inches Solder Mask Yes, Both Sides Solder Mask Color Green Solder Mask Type LPI Solder Mask Finish Standard Semi‐Gloss Silk Screen Yes, Both Sides Silk Screen Color White Number of Sides for Assembly 2 (Not all boards require both sides) Lead‐Free Processing Yes
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