SATPC0030676 Tab 04 SOW.pdf
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Technical Requirements for Upgrade to X-Ray Photoelectron Spectrometer (XPS) System
This package removes a large part of the electronics of the VersaProbe I to allow the implementation of many software and hardware features of the VersaProbe II. The VersaProbe I will be deemed obsolete by instrument manufacturer at the end of 2024 and will no longer be supported by a service contract.
Listed are the key features and changes gained from the upgrade:
Update Details
• VersaProbe I card racks removed and replaced with VersaProbe II electronics
• New Intro Camera and necessary brackets installed
• New State of the art Windows 10 computer
• Latest version of SmartSoft
• Latest version of MultiPak
• Sample holders will not change
- Maximum sample holder size is 60mm
• Resets the age of the system with reduced cost service contract
SmartSoft UserInterface
• Greatly improved user interface
• More automated transfer process
• Organized workflow
• Integrated platen management
• Intuitive queuing for improved multi sample automated analysis and higher throughput
• Stored recipes and analysis locations
• Improved point and click navigation on SXI image
• Point and click navigation on optical image
• Real-time multi-level system status logging and error reporting
• Enhanced service tools
• Software controlled analyzer calibration
• Multilevel system status logging
New Introduction Camera
• DSLR camera image with digital zoom
• Navigation is much easier
• Side-by-side view with SXI
• Drop analysis points right on optical image
Performance Changes
• 128 Channel detection Provides excellent chemical state mapping capability Improves depth profiling capabilities This capability improves data quality and can be achieved in a fraction of the time.
• New electronics Improves system/electronic overhead for increased acquisition speed Service diagnostics are markedly improved with electronic/software system status and error reporting.
• Constant pressure Ar leak for monoatomic ion gun (fixed leak valve option)
Enables shorter and more stable sputter intervals during depth profiling
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