Salient Characteristics (21Q0235).doc

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ProtoLaser U4 Laser Patterning System with Ultraviolet (UV) Laser
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W911QX21Q0235
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Salient Characteristics

Commercial Availability Certification:

I have evaluated the commercial marketplace and determined that all of the salient characteristics documented below are available in products/services offered in the commercial marketplace.

Signature (typed name): Eugene Zakar Technical Point of Contact (TPOC) or Contracting Officer’s Representative (COR)

Technical Requirements for Laser Patterning System with Ultraviolet (UV) Laser The Army Research Laboratory (ARL) Sensors and Electron Devices Directorate (SEDD) Advanced Electronics Branch requires the following in support of the research and development of advanced high frequency and radio frequency electronics for contested environments requiring high selectivity and low distortion characteristics. The Contractor shall provide the following:

· Quantity One (1) ProtoLaser U4 Laser Patterning System with Ultraviolet (UV) Laser (PN: 0055358)

· Quantity One (1) Brushless Vacuum: Dust extraction unit for ProtoLaser Models ST, S4, U4, R4, D104 and MicroLine Ultraviolet (UV) systems (120v) Model

· Quantity One (1) Day On-Site Installation (A-50-1129)

· Quantity One (1) Additional Day On-Site Installation (A-50-1130) The ProtoLaser U4 Laser Patterning System with Ultraviolet (UV) Laser (PN: 0055358) shall have the following specifications:

· 20 micrometer (µm) UV laser capable of cutting silicon and ceramics

· Electromagnetic properties and tunable characteristics of the components require minimum feature sizes of 50 µm.

· Alignment accuracy approaching +/- one (1) µm.

· Automatic recognition of fiducial marks with alignment accuracy of +/- one (1) µm

· Capability of etching 50 µm wide copper lines without leaving additional artifacts, such as defective hatch markings, on the etched features.

· The system shall be mobile, allowing for movement between labs and shall fit through 33 inch wide doorways.

· Working area that shall accommodate single component geometries, full wafers, and boards up to 200 millimeters (mm) (approximately eight (8) inches) in diameter or squares.

Contracting Officer:

Template last updated 01/8/2019

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