FBO_RFQ-5742_-_Technical_Specifications.xlsx

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Microwave Plasma Decapsulation System
Solicitation number
RFQ-5742
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Specifications - RFQ-5742

SPECIFICATION LIST
RFQ-5742 - Microwave Plasma Decapsulation System
Line ItemQuantityManufacturerPart NumberDescriptionAdditional Details
00011 eachNisene Technology
GroupSMT6000Plasma Etch Microwave Plasma Decapsulation SystemINCLUDES:

- Windows-Based Intel Pentium Computer and Touch Screen System Controller

- 200 Watt Microwave Source

- 200 Watt 2.45 Microwave Power Supply with Automatic Tuning Automated Pressure Control Throttle Valve with Absolute Pressure Transducer

- Focus Radical Discharge Assembly

- Process Gas Compatible Mass Flow Controllers (x 3)

- Process Gas Regulators with Downstream One Way Shut Off Valve and In-Line Process Gauge (x 3)

MINIMUM REQUIREMENTS:

- Inductively Coupled 2.4 GHz Microwave Plasma

- Minimum Etch Rate of 16 μm/min (0.016 mm/min)

- Automated Pressure Control

- 3phase 208 V Electrical Supply

- 1 Year Manufacturer Warranty (Parts & Labor)

00021 eachNisene Technology
GroupStandard
on SMT6000Plasma Etch
Installation & TrainingComplete On-Site Training for Operators by Certified Technician. Training Shall Cover Device Decapsulation and Routine Maintenance.
00031 eachNisene Technology
GroupStandard
on SMT6000Plasma Etch Fume Extraction SystemFour-Stage Filter System.
00041 eachNisene Technology
GroupStandard
on SMT6000Plasma Etch
Chiller SystemRecirculating Chiller with Set-Point Range of -10 - 90 degrees (C), Stability 0.1 degree (C), CE-Compliant.
00051 eachNisene Technology
GroupStandard
on SMT6000Plasma Etch
Vacuum PumpDual-Stage with Oil-Sealed Rotary Pump. Designed for Corrosive Material.
00061 eachN/AN/AShipping & Handling

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