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RFQ 0004753
U.S.
Department of Justice Federal Bureau of Investigation
RFQ 0004753
PLEASE READ THIS NOTICE CAREFULLY AS IT CONSTITUTES THE ONLY NOTICE THAT WILL BE ISSUED. This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in Federal Acquisition Regulations (FAR) Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation; quotes are being requested and a written solicitation will not be issued. Interested parties are responsible for monitoring this site to ensure they have the most up to date information about this acquisition. No partial quotes will be considered. No partial awards will be made.
The solicitation number is RFQ0004753 and is issued as a Request for Quote (RFQ). The North American Industrial Classification System (NAICS) code for this requirement is 334220 Radio and Television Broadcasting and Wireless Communications Equipment Manufacturing; the size standard is 750 employees. The resultant contract will be a firm-fixed price contract. This solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular FAC 2005-84. This requirement will be awarded on an all or none basis as a commercial item, fixed price purchase order under the procedures at FAR Parts 12 and 13.
1.0 Supplies or Service
The FBI requires the following items, Brand Name only, for the following:
| Line Number |
| Qty |
| Manufacturer |
| Part Number |
| Description |
| 1 |
| 4 |
| Dataman |
| Dataman-48Pro2 |
| Super Fast Universal 48-Pin Programmer with ISP capabilities and USB 2.0 Connectivity |
| 2 |
| 2 |
| Dataman |
| BGA-Bottom-153* |
| Bottom board of BGA adapter for STMicroelectronics Family of devices, Type STM32F103ZE |
| 3 |
| 2 |
| Dataman |
| BGA-Bottom-95* |
| Bottom board of BGA adapter for Samsung K5D1212/ Toshiba T900A/ ST NAND01G-N |
| 4 |
| 2 |
| Dataman |
| BGA-Bottom-194 |
| Bottom Board of BGA adapter for Samsung K5G5629ATB-SF75 with balls in matric 14x14-8x8 |
| 5 |
| 2 |
| Dataman |
| BGA-Bottom-91 |
| Bottom Board of BGA Adapter for NAND flash MCO devices with balls in matrix 13x13 |
| 6 |
| 2 |
| Dataman |
| BGA-Bottom-41* |
| Bottom board of BGA adapter for Lattice LC4xxxV/B/C family with balls in matrix 16x16 |
| 7 |
| 2 |
| Dataman |
| BGA-Bottom-131 |
| Bottom board of BGA adapter for Samsung MCP devices with balls in matrix 22x22 |
| 8 |
| 2 |
| Dataman |
| BGA-Bottom-24a |
| Bottom board of BGA adapter for Flash devices with balls in matrix 12x8 |
| 9 |
| 4 |
| Dataman |
| BGA-Bottom-2* |
| Bottom board of BGA adapter for flash devices with balls in matrix 8x8 |
| 10 |
| 2 |
| Dataman |
| BGA-Bottom-25* |
| Bottom board of BGA adapter for flash devices with balls in matrix 10x8 |
| 11 |
| 2 |
| Dataman |
| BGA-Bottom-28* |
| Bottom board of BGA adapter for flash devices with balls in matrix 10x8 |
| 12 |
| 6 |
| Dataman |
| BGA-Bottom-14* |
| Bottom board of BGA adapter for flash devices with balls in matrix 8x6 |
| 13 |
| 2 |
| Dataman |
| BGA-Bottom-15* |
| Bottom board of BGA adapter for flash devices with balls in matrix 10x8 |
| 14 |
| 2 |
| Dataman |
| BGA-Bottom-94* |
| Bottom board of BGA adapter for S71WS256PC0HF3TL with balls in matrix 10x8 |
| 15 |
| 2 |
| Dataman |
| BGA-Bottom-18 |
| Bottom board of BGA adapter for SST SST32HF162C/164C/324C/SST34HF162C/164C/162G/164G in matrix 8x6 |
| 16 |
| 2 |
| Dataman |
| BGA-Bottom-165 |
| Bottom board of BGA adapter for eMMC devices in matrix 14x14-8x8+6x6-4x4 |
| 17 |
| 2 |
| Dataman |
| BGA-Bottom-164 |
| Bottom board of BGA adapter for Spansi9on S72NS-N Based MCPs devices with Balls in matrix 14x14-8x8 |
| 18 |
| 2 |
| Dataman |
| Bottom TSOP48NOR-1 |
| Bottom board of TSOP converters, for flash devices |
| 19 |
| 2 |
| Dataman |
| BGA-Top-176ZIF-CS |
| Top board of BGA adapter for ZIF BGA 196 |
| 20 |
| 2 |
| Dataman |
| BGA-top-43ZIF-CS* |
| Top board of BGA adapter for ZIF BGA100, Clamshell type |
| 21 |
| 2 |
| Dataman |
| BGA-Top-125ZIF-CS |
| Top board of BGA adapter for ZIF BGA107 (accept package up to 120 balls), ClamShell type |
| 22 |
| 2 |
| Dataman |
| BGA-Top-178ZIF |
| Top Board of BGA adapter for ZIF BGA 152 |
| 23 |
| 2 |
| Dataman |
| BGA-Top 33ZIF* |
| Top BGA adapter |
| 24 |
| 2 |
| Dataman |
| BGA-Top-51aZIF-CS |
| Top board of BGA adapter for ZIF BGA107 |
| 25 |
| 2 |
| Dataman |
| BGA-Top-116ZIF |
| Top board for BGA adapter for ZIF BGA48 |
| 26 |
| 2 |
| Dataman |
| BGA-Top-157ZIF-CS |
| BGA Top Adapter, ZIF-CS |
| 27 |
| 2 |
| Dataman |
| BGA-Top048ZIF* |
| Top Board of BGA adapter for ZIF BGA80 (accept package up to 120 balls), open top type |
| 28 |
| 2 |
| Dataman |
| BGA-Top-77ZIF-CS* |
| Top board of BGA adapter for ZIF BGA64 (accept package up to 64 balls), ClamShell type |
| 29 |
| 4 |
| Dataman |
| BGA-Top-28ZIF-CS* |
| Top board of BGA adapter for ZIF BGA56 (accept package up to 133 balls), ClamShell type |
| 30 |
| 2 |
| Dataman |
| BGA-Top-299ZIF(a) |
| Top board of BGA adapter for eMMC devices in ZIF BGA153 |
| 31 |
| 4 |
| Dataman |
| BGA-Top-62ZIF-CS |
| Top board of BGA adapter for ZIF BGA60 |
| 32 |
| 2 |
| Dataman |
| BGA-Top-8ZIF-CS |
| Top board of BGA adapter for ZIF BGA48 |
| 33 |
| 2 |
| Dataman |
| BGA-Top-162ZIF-CS* |
| Top board of BGA adapter for ZIF BGA76, ClamShell type |
| 34 |
| 2 |
| Dataman |
| BGA-Top-4ZIF-CS* |
| Top board of BGA adapter for ZIF BGA64 (accept package up to 120balls), ClamShell type |
| 35 |
| 2 |
| Dataman |
| BGA-Top-23ZIF-CS* |
| Top board of BGA adapter for ZIF BGA64 (accept package up to 64 balls), ClamShell type |
| 36 |
| 2 |
| Dataman |
| BGA-Top-54ZIF* |
| Top board of BGA adapter for ZIF BGA96, open top type |
| 37 |
| 4 |
| Dataman |
| BGA-Top-79ZIF-CS* |
| Top Board of BGA adapter for ZIF BGA48 (accept package up to 48 balls), ClamShell type |
| 38 |
| 6 |
| Dataman |
| BGA-Top-95ZIF-CS* |
| Top Board of BGA adapter for ZIF BGA52 (accept package up to 76 balls), ClamShell type |
| 39 |
| 2 |
| Dataman |
| BGA-Top-11ZIF-CS* |
| Top board of BGA adapter for ZIF BGA64 (accept package up to 120 balls), ClamShell type |
| 40 |
| 2 |
| Dataman |
| BGA-Top-54ZIF |
| Top board of BGA adapter for ZIF BGA96, open top type |
| 41 |
| 2 |
| Dataman |
| BGA-Top-34ZIF-CS* |
| Top board of BGA adapter for ZIF BGA66, ClamShell type |
| 42 |
| 4 |
| Dataman |
| BGA-Top-29ZIF* |
| Top Board of BGA adapter for ZIF BGA80 (accept package up to 120 balls), open top type |
| 43 |
| 4 |
| Dataman |
| BGA-Top-110ZIF-CS* |
| Top board for BGA adapter for ZIF BGA64 |
| 44 |
| 2 |
| Dataman |
| BGA-Top-47ZIF-CS* |
| Top board of BGA adapter for SCSP88 10x8mm-12x8 ball array, 0.8mm pitch package |
| 45 |
| 6 |
| Dataman |
| BGA-Top-41ZIF-CS* |
| Top board of BGA adapter for ZIF BGA40 (accept package up to 96 balls), ClamShell type |
| 46 |
| 4 |
| Dataman |
| BGA-Top-61ZIF-CS* |
| Top board of BGA adapter for ZIF BGA56, ClamShell type |
| 47 |
| 2 |
| Dataman |
| BGA-Top-21ZIF-CS* |
| Top board of BGA adapter for ZIF BGA48 (accept package up to 48 balls), ClamShell type |
| 48 |
| 2 |
| Dataman |
| BGA-Top-193ZIF-CS (a) |
| Top board of BGA adapter for eMMC devices in ZIF BGA50 |
| 49 |
| 2 |
| Dataman |
| BGA-Top-135ZIF* |
| Top board of BGA Adapter for ZIF BGA88 (accept package up to 96 balls), open top type |
| 50 |
| 2 |
| Dataman |
| BGA-Top-145ZIF-CS* |
| Top board of BGA adapter for ZIF BGA133, ClamShell type |
| 51 |
| 2 |
| Dataman |
| BGA-Top-143ZIF-CS |
| Top board of BGA converters |
| 52 |
| 2 |
| Dataman |
| DIL48/TSOP48ZIF18.4mm |
| Adapter for TSOP devices with 48-pins |
| 53 |
| 2 |
| Dataman |
| DIL8W/SOIC8ZIF200milSFlash-1a |
| Device specific adapter for Sflash-1 SOIC8 devices up to 8-pins |
| 54 |
| 4 |
| Dataman |
| DIL8W/SOIC8ZIF200mil |
| Adapter for 200mil SOIC devices up to 8 pins |
| 55 |
| 2 |
| Dataman |
| DIL8/SOIC8-1ZIF170mil |
| Adapter for 170mil SOIC devices with 8 pins (Universal) |
| 56 |
| 2 |
| Dataman |
| DIL8W/SOIC8ZIF150mil |
| Adapter for SOIC devices up to 8-pins (Universal) |
| 57 |
| 2 |
| 848IN060 |
| DIL44/PLCC44ZIF |
| Adapter for devices in PLCC44 package, Replaces the SDP-UNIV-44 |
1.1 Shipping Requirement
All deliveries under this order shall be FOB destination.
1.2 Delivery Requirement
All items will be shipped to:
Federal Bureau of Investigation 2501 Investigation Parkway Quantico, VA 22135
The contractor shall extend to the Government full coverage under a normal commercial warranty. Acceptance of the warranty does not waive the Governments rights with regard to the other terms and conditions of this contract. The warranty period shall begin upon final acceptance of all items provided to the government by the Contractor. FAR Clauses and Provisions applicable to this acquisition can be obtained from the website, http://www.acqnet.gov.
2.0 Quote Requirements
· New Equipment only will be accepted for this procurement.
· Quote must be valid for 30 days from closing of posting.
Please include in your quote: pricing and product description for each line item listed above. Quote may be sent via your company’s standard quotation form but must include the following information: Tax ID #, DUNS #, Point of Contact with Email and telephone information.
2.1 Question Submission
Interested offerors must submit any questions concerning the solicitation at the earliest time possible to enable the Buyer to respond. Questions may be submitted to the attention of Kemper Wood at kemper.wood@ic.fbi.gov, no later than Wednesday, April 27, 2016 at 3:00 PM (Eastern).
2.2 Quote Submittal
Quotes shall be submitted by email to Kemper Wood, Contract Specialist, kemper.wood@ic.fbi.gov, no later than Monday, May 2, 2016 at 8:00 AM (Eastern).Quotes shall be clearly marked RFQ0004753. Offerors are hereby notified that if their quotes are not received by the date, time and location specified in this announcement, it will not be considered by the agency. Telephone request will not be considered. No questions will be answered over the telephone. Offers must be valid for 30 calendar days after submission.
3.0 Terms and Conditions
The selected offeror must comply with the following commercial item terms and conditions, which are incorporated herein by reference: FAR 52.212-1, Instruction to Offerors-Commercial Items, applies to this acquisition; FAR 52.212-3, Offeror Representations and Certifications-Commercial Items-the selected offeror must submit a completed copy of the listed representations and certifications; FAR 52-212-4, Contract Terms and Conditions-Commercial Items; FAR 52-212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders-Commercial Items, paragraph (a) and the following clauses in paragraph (b): 52.222-21, 52.222-26, 52.222-35, 52.222-36, 52.222-37, 52.225-13, 52.232-34. The full text of the referenced FAR clauses may be accessed electronically at https://www.acquisition.gov/far/.
Corporate Representation Regarding Felony Conviction Under Any Federal Law or Unpaid Delinquent Tax Liability-Solicitation (March 2015)
(a) None of the funds made available by the Department’s current Appropriations Act may be used to enter into a contract, memorandum of understanding, or cooperative agreement with a corporation-
(1) Convicted of a felony criminal violation under any Federal law within the preceding 24 months, where the awarding agency is aware of the conviction, unless an agency has considered suspension or debarment of the corporation and made a determination that this further action is not necessary to protect the interests of the Government, or
(2) That has any unpaid Federal tax liability that has been assessed, for which all judicial and administrative remedies have been exhausted or have lapsed, and that is not being paid in a timely manner pursuant to an agreement with the authority responsible for collecting the tax liability, where the awarding agency is aware of the unpaid tax liability, Unless an agency has considered suspension or debarment of the corporation and made a determination that this further action is not necessary to protect the interests of the Government.
(b) By submitting a response to this solicitation, the offeror represents that, as of the date of this offer-
(1) The offeror is not a corporation convicted of a felony criminal violation under any Federal or State law within the preceding 24 months; and,
(2) The offeror is not a corporation that has any unpaid Federal or State tax liability that has been assessed, for which all judicial and administrative remedies have been exhausted or have lapsed, and that is not being paid in a timely manner pursuant to an agreement with the authority responsible for collecting the tax liability.
Contractor Internal Confidentiality Agreements or Statements Prohibiting or Restricting Reporting of Waste, Fraud and Abuse-Solicitation (March 2015)
None of the funds appropriated to the Department under its current Appropriations Act may be used to enter into a contract, grant or cooperative agreement with an entity that requires employees or contractors of such entity seeking to report fraud, waste, and abuse to sign internal confidentiality agreements or statements prohibiting or otherwise restricting such employees or contractors from lawfully reporting such waste, fraud or abuse to a designated investigative or law enforcement representative of a Federal department or agency authorized to receive such information. By submitting a response to this solicitation, the contractor certifies that it does not require employees or contractors of the contractor seeking to report fraud, waste and abuse to sign internal confidentiality agreements or statements prohibiting or otherwise restricting such employees or contractors from lawfully reporting waste, fraud and abuse to a designated investigative or law enforcement representative of a Federal department or agency authorized to receive such information.
3.1 System for Award Management (SAM) Requirement
Note: Ensure your firm is registered in System for Award Management (SAM) - All vendors must be registered in SAM, effective July 29, 2012, to receive government contracts. The FBI is utilizing a new financial system that has a direct interface with the SAM. If any current FBI vendor data conflicts with SAM Data, the information contained in SAM may override our current information. Please ensure that your company’s SAM information is updated and accurate. This includes: TIN, EFT, DUNs, addresses and contact information. The EFT banking information on file in SAM will be what the FBI uses to process payment to your organization.
4.0 Evaluation Factors
Award will be made to the lowest price/technically acceptable offeror.
A Justification and Approval (J&A) supporting this procurement is available upon request.
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