Phase II - HPCM RFI2_FINAL.pdf

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited. OPSEC#9190

Description of Intent:

The U.S. Army Contracting Command - Detroit Arsenal (ACC-DTA), in conjunction with U.S. Army’s Combat Capabilities Development Command Ground Vehicle Systems Center (DEVCOM GVSC) Vehicle Electronics and Architecture (VEA), is issuing a Request for Information (RFI) for the procurement of an Embedded High Performance Computing for Ground Vehicle Edge Processing (EHPCGVEP) solution for U.S. Army Ground Combat Vehicles. A EHPCGVEP is a computing device that balances edge computing and centralized computing. GVSC - VEA is requesting information on all potential Embedded High Performance hardware solutions that address EHPCGVEP. However, VEA is not soliciting enterprise EHPCGVEP solutions at this time.

Current U.S. Army Ground Combat vehicles intend to make use of emerging technologies to balance edge and centralized computing. These needs are based upon new features and capabilities to support fused sensor data with enough processing capacity to support additional capabilities including, but not limited to, Aided Target Detection/Recognition (AiTDR), Automated Lethality, Survivability, and Defense. The goal is to take current algorithms for these technologies as well as Artificial Intelligence/Machine Learning (AI/ML) capabilities and evaluate them for true processing needs.

The objective of this RFI is to better understand the availability and capabilities of products and the potential of manufacturers in both processor and processing technologies as well as gaining an understanding of total package integration challenges. The goal is to find that equilibrium balance of edge and centralized computing. The information gathered by the U.S. Army through this RFI, along with other market investigation data, is solely intended for use by the U.S. Army and will not be shared with any company. Participation in this RFI provides an important opportunity to influence the U.S. Army’s approach to procuring the EHPCGVEP solution for U.S. Army Ground Combat Vehicles. The U.S. Government is in no way liable to pay for or reimburse any companies or entities that respond to this announcement. Any costs incurred by interested companies in response to this announcement will NOT be reimbursed. This is a RFI ONLY and is not a solicitation for proposals; therefore, no questions will be taken at this time. A prototype project will not be awarded in response to this announcement.

RESPONSE TIME: We thank you in advance, for your time and participation in this RFI. The U.S.

Government requires all responses be returned by 3:00 pm Eastern Standard Time (EST), 17 December 2024 to Allison Kasper at allison.m.kasper.civ@army.mil.

PART 1. BUSINESS INFORMATION: Please provide the following:

Administrative information as the first section of your submission.

1. Manufacturer

a. Company Name (and any former names):

b. Traditional or Non-Traditional Contractor:

*Non-Traditional Contractor: An entity that is not currently performing and has not performed, for at least the one-year period preceding the solicitation of sources by DoD for the procurement or transaction, any contract or subcontract for the DoD that is subject to full coverage under the cost accounting standards prescribed pursuant to section 1502 of title 41 and the regulations implementing such section (see 10 U.S.C.2302(9)).

c. Mailing Address:

2. Personnel Responding to this Survey

a. Name:

b. Title:

c. Company Responsibility/Position:

d. Telephone/Fax Numbers:

e. E-mail address:

PART 2. ADDITIONAL INFORMATION:

The Army intends for this hardware solution to be in a U.S. Army Ground Combat vehicle where space is constrained, the operating environment is harsh, cooling options are limited, and reliability must be extremely high. The intent is to develop a common compute & with graphical processing, not only executing AI algorithms but also provide processing multipurpose applications. The Army intends this to be a TRL 3 prototype and be able to develop it into a TRL 5 or TRL 6 prototype within the next 24 months.

PART 3. REQUIREMENTS:

1. Hardware solution must fit within 9.3in x15.9in x16.1in, this will include external connectors to include cooling solution

2. The HPCM shall have a volume of 1200 Cu in. The total integrated volume to include the HPCM, connectors, cable mating, and cooling solution shall be no greater than 2380 Cu in.

a. The cooling solution will have no additional airflow outside of that volume and have a single plane airflow access available

3. Hardware solution shall meet ATPD-2404-B – Section 5.2.1 - High temperature when development reaches TRL5

4. Hardware solution shall meet ATPD-2404-B – Section 5.3.6 – Immersion when development reaches TRL5

5. Hardware solution shall meet ATPD-2404-B – Section 5.3.11 – Contamination by fluids when development reaches TRL5

6. Hardware solution shall pass MIL-STD-810H – Section 501.7 – High Temperature when development reaches TRL5

7. Hardware solution shall pass MIL-STD-810H – Section 504.3 - Contamination by Fluids when development reaches TRL5

8. Hardware solution shall pass MIL-STD-810H – Section 512.6 – Immersion when development reaches TRL5

9. Hardware solution shall find the optimal solution between reliability, component power, computational performance and operating temperature

a. The target for power is 150 watts, computing is 540 Tera Operations per Seconds (TOPS), and ambient operating temperature that ranges from -40° C to +52° C

10. Hardware solution must have RAM that meets Mean Time Between Failures (MTBF) > 3,000 operating hours

a. Hardware solution must meet 99.8% operational availability

11. The hardware solution must provide a Safety Certifiable processing capability that is certifiable to Internation Standards Organization (ISO) 26262 Automotive Safety Integrity Levels -D (ASIL) and International Electrotechnical Commission (IEC) 61508 or equivalent safety process

12. Hardware solution must have a commercial automotive level of safety ASIL-D

PART 4. TECHNICAL QUESTIONNAIRE:

1. What are your proposed solutions based on the requirements given?

a. Please include technical data for your proposed solutions

2. What are the planned dimensions of the hardware solutions?

13. What solutions can be recommended for optimal performance with the targets for

Component Power at 150 watts, computational performance of 540 TOPS and ambient operating temperature that ranges from -40° C to +52° C

3. What is the solution for thermally managing the hardware?

a. Can you provide an innovative solution for thermally managing the hardware within the space claim provided?

4. What data can you show to support the RAM requirement? (i.e. Mathematical model is sufficient)

5. Do you propose any additional requirements for this application?

6. Are there any problematic requirements that have severe trade-offs?

7. What types of authentication protocols do you support?

8. What type of encryption methods do you support?

9. Do you have any cross domain systems that are a part of the NCDSMO baseline (National

Cross Domain Strategy & Management Office)?

10. What health monitoring and fail-over/reboot procedures do you implement?

11. Does your solution support Trusted Platform Module (TPM) 2.0? If so, please elaborate.

12. Does your solution implement National Security Agency (NSA) compliant encryption? If so, please elaborate.

13. Does your solution support Unified Extensible Firmware Interface (UEFI)? If so, please elaborate.

14. Does your solution implement secure boot? If so, please elaborate.

15. Does your solution implement measured boot? If so, please elaborate.

https://www.nsa.gov/Cybersecurity/Partnership/National-Cross-Domain-Strategy-Management-Office/ https://www.nsa.gov/Cybersecurity/Partnership/National-Cross-Domain-Strategy-Management-Office/

16. Does your solution provide a Trusted Execution Environment (TEE)? If so, please elaborate.

17. Does your solution provide a hardware root of trust? If so, please elaborate.

18. Does your solution implement trusted boot? If so, please elaborate.

Technology Readiness Levels (TRLs)

Level 1: Basic Principles observed and reported:

Lowest level of technology readiness. Scientific research begins to be translated int applied research and development. Examples might include paper studies of a technology’s basic properties.

Level 2: Technology concept and/or application formulated:

Invention begins. Once basic principles are observed, practical applications can be invented. Applications are speculative and there maybe no proof or detailed analysis to support the assumptions. Examples are limited to analytic studies.

Level 3: Analytical and experimental critical function and/or characteristic proof of concept.

Active research and development is initiated. This includes analytical studies and laboratory studies to physically validate analytical predictions of separate elements of the technology. Examples include components that are not yet integrated or representative.

Level 4: Component and/or breadboard validation in laboratory environment.

Basic technological components are integrated to establish that they will work together.

This is relatively “low fidelity” compared to the eventual system. Example include integration of “ad hoc” hardware in the laboratory.

Level 5: Component and/or breadboard validation in relevant environment.

Fidelity of breadboard technology increases significantly. The basic technological components are integrated with reasonably realistic supporting elements so it can be tested in a simulated environment. Examples include “high fidelity” laboratory integration of components.

Level 6: System/subsystem model or prototype demonstration in a relevant environment.

Representative model or prototype system, which is well beyond that of TRL 5, is tested in a relevant environment. Represents a major step up in a technology’s demonstrated readiness. Examples include testing a prototype in a high-fidelity laboratory environment or in simulated optional environment.

Level 7: System prototype demonstration in an operational environment.

Prototype near, or at, planned operational system. Represents a major step up from TRL 6, requiring demonstration of an actual system prototype in an operational environment such as an aircraft, vehicle, or space. Example include testing the prototype in a test bed aircraft.

Level 8: Actual system completed and qualified through test and demonstration.

Technology has been proven to work in its final form and under expected conditions. In almost all cases, this TRL represents the end of true system development. Examples include developmental test and evaluation of the system in its intended weapon system to determine if it meets design specifications.

Level 9: Actual system proven through successful mission operations.

Actual application of the technology in its final form and under mission conditions, such as those encountered in operational test and evaluation. Examples include using the system under the system under operational mission conditions.