Specifications.pdf

SPECIFICATIONS

Multi-wavelength Ellipsometer

NB 687100-18- 02724

BACKGROUND:

In fabricating optoelectronic and superconducting devices, the Boulder Microfabrication Facility (BMF) at the National Institute of Standards and Technology (NIST) is required to use thin films of dielectric materials such as SiO2 and Si3N4 to create electrical insulators and optical structures. As the BMF develops processes to create these films and during the manufacture of devices utilizing these films NIST requires fast accurate measurement of the thickness and optical properties of these films. A Multi-Wavelength Ellipsometer is the ideal tool to provide the functionality required. These instruments work by illuminating the reflective surface of the wafer with polarized light at an angle to the wafer and measuring the polarization of the reflected light. It uses this measurement to solve equations that give the film thickness, as well as real and imaginary optical constants. The use of multiple wavelengths or incidence angles permit measurements for films where the equations governing the reflected light cannot yield a unique solution.

PURPOSE:

The Boulder Microfabrication Facility requires a Multi-Wavelength Ellipsometer to provide measurements of thin dielectric films on wafers.

SPECIFIC REQUIREMENTS:

One (1) each Multi-Wavelength Ellipsometer

The ellipsometer shall be a production model, not a prototype or one-of-a-kind system.

TECHNICAL SPECIFICATIONS:

1. Wavelength Requirements: NIST requires at least three distinct wavelengths of operation. Additional wavelengths or full spectroscopic operation is preferable. The use of multiple wavelengths allows for measurement of films and film stacks at wavelengths where the operation of the instrument would prevent accurate or unique solutions to the ellipsometry equations.

2. Spot Size (Measurement Area) Requirements: NIST requires the instrument be capable of measuring area of less than 1 mm x 1 mm. When NIST measures on in-process wafers, measurements are performed on metrology sites scattered across the surface of the wafer.

Spot sizes smaller than 1mm x 1mm are preferred but not required.

3. Angle Requirements: NIST requires the tool to provide at least one angle for the incident and reflected light in the range of 60 to 75 degrees. While NIST understands the benefits of multiple angles, more than one incident angle are not required.

4. Wafer Size and Positioning Requirements: NIST requires that the instrument be capable of performing measurements on samples ranging in size for 6 mm x 6 mm chips up to 150 mm diameter wafers. The stage shall be able to position to arbitrary positions across the full 150 mm wafer surface. The stage shall be adjustable for wafer thickness and allow for the measurement of wafer between 0.2 mm and 2mm in thickness. It is preferred that the stage be automated to allow for mapping of unpatterned wafers.

5. Imaging of Measurement Region: NIST requires that the instrument provide some means of determining the measurement region on the wafer surface. This is to insure NIST is measuring on the metrology test site. This can be accomplished using a microscope or camera system to view the wafer surface. It is not required to have a full imaging system capable of automatic alignment and feature recognition. It is only required that the imaging system give the operator feedback as to the position of the wafer relative to the measurement area.

6. Computer/Software. The system shall be provided with the necessary software to control the instrument and take data. It is preferred that the tool be equipped with software capable of taking whole wafer maps of thickness and optical index. The computer to run the tool shall either be included or sufficient specifications to allow us to provide one shall be included

PERFORMANCE SPECIFICATIONS:

1. Accuracy and Precision: In general use NIST will use this to measure various films (such as SiO2, Si3N4 and others) and thicknesses ranging from a few nm to 2 um, on various substrates (Si, Al, Nb, TiN, Au and others). It would be unreasonable to create specifications for everything NIST may ultimately want to do with this machine. As a result, NIST will specify that the tool be capable of measuring of the thickness of 100 nm SiO2 on Si with an accuracy of 0.5 nm and a precision of 0.1 nm and measuring the index of 100 nm SiO2 on Si with an accuracy of 0.01 with a precision of 0.002.

2. Speed of Measurement: NIST would like to use this tool to make whole wafer maps of blanket films in a reasonable time. NIST requires that the tool is capable of making a measurement for all wavelengths at a single position in under 30 seconds. In this way NIST could make at 49 points in under 30 minutes. NIST would prefer to be able to make a full wafer map in under 10 minutes.

GOVERNMENT FURNISHED PROPERTY OR INFORMATION:

N/A

DELIVERY:

1. Delivery shall be FOB DESTINATION and occur No Later Than October 1, 2018 unless mutually agreed upon the Government’s ability to receive earlier.

2. In accordance with 52.247-35, the Contactor shall deliver the system to:

NIST

325 Broadway Boulder CO, 80305.

INSTALLATION:

1. After consultation with NIST the contractor will determine if a site inspection is required before delivery.

2. The tool shall be installed in the cleanroom by BMF personnel. Installation and setup by the manufacturer will only be necessary if required by the manufacturer.

3. NIST will install all required facility hookups to the system.

4. Training by the manufacturer is desirable but not required.

5. All equipment shall be Class 100 clean-room compatible, designed to sit entirely within the cleanroom.

TESTING AND INSPECTION:

1. The BMF (687.10) will physically inspect the Multi-Wavelength Ellipsometer to verify that it meets the requirements listed in the Technical and Performance Specifications.

2. The tool will be used to measure reference samples of SiO2 on Si to verify correct performance.

3. Final acceptance will be determined within 30 calendar days after tool commissioning and user training is completed.

WARRANTY:

One-year warranty shall be included.

SECURITY:

N/A

PAST EXPERIENCE:

There shall be at least 5 working units of the proposed make and model operating currently in the field. All equipment shall be Class 100 clean-room compatible, designed to sit entirely within the cleanroom.