NB686010-20-01608 Draft SOW.pdf

Statement of Work BMF Thermistor sputter system

NB686010-20-01608

1. Background Information:

a. NIST-Boulder has a state-of-the-art research laboratory (the Katharine Blodgett

Gebbie Building) to support the most sensitive research done at NIST. Included in this building is a Class 100 microelectronics fabrication facility, called the Boulder Micro-fabrication Facility (BMF). The BMF is expanding its capabilities to produce detectors for NASA’s Earth Venture Continuity (EVC) satellite platform – a $130 million mission lead by LASP, CU Boulder, in collaboration with NIST. NIST will fabricate custom radiometers for the mission. A dedicated system to support detector fabrication is required to meet mission-critical milestones such as testing and launch deadlines. Therefore, the BMF requires a sputter deposition system.

2. Scope of Work:

a. Objectives:

i. The goal of this contract is to supply, install, and train users on a sputter deposition system that meets the needs of NASA’s EVC mission.

b. General:

i. The Contractor shall:

1. Provide evidence of experience of supplying, installing, and training new users on at least one sputter deposition systems with similar requirements to those in the statement of work. Evidence of this criterion shall be demonstrated with appropriate documentation.

2. Provide personnel that pass required government background checks to be issued badges for work on site.

3. Provide a Request for Quotation, which details all planned materials, consumables, travel, labor, equipment, and expenses.

4. Supply the installation manual, utility requirements, and a diagram showing the tool footprint, measurements, and (if needed) wall penetrations along with the request for quotation.

5. Provide a drawing showing how the system shall fit into the required space, as shown in Attachment 1. Specifically, the system, along with any auxiliary equipment including but not limited to: electronics racks, vacuum pumps, water chillers, heat exchangers, and gas boxes, must be able to fit in the space of 6 feet

BMF Thermistor Sputter System SOW deep, 8 feet wide, and 8 feet tall in a class ISO 5 clean space and a 6 feet deep, 8 feet wide and 8 feet tall space in a mechanical chase.

The tool load lock door, main chamber door, and computer must be located in the clean space, and all other ancillary equipment must be able to fit in the chase space. The proposed layout must include space for all door swings, etc.

ii. Specifications for the Work:

1. NIST Security shall badge all staff from the selected vendor. No one may enter the site without a badge.

2. All work shall be scheduled with the TPOC prior to arrival to do the work.

c. Specific Requirements:

i. At a time to be coordinated after the award of the contract, the Contractor shall:

1. Supply, install, and train new users on a sputter deposition system that meets the technical specifications in section 2.c.ii.

ii. The sputter deposition system shall:

1. Be constructed with materials that are compatible for use in an ISO

Class 5 cleanroom.

2. Be designed for normal operation at an altitude of 5,500 feet above sea level.

3. Be integrated into the wall of the cleanroom so that the main chamber, load lock, electronics, and pumps are all in the chase, while the load lock door, main chamber door, and computer protrude into the clean space.

4. Be a vacuum system with a base pressure of 1E-6 Torr or less.

The vacuum system shall use only oil-free, dry pumps, and turbo pumps. The vacuum system shall include foreline purge/vent protection and a foreline throttle valve. To meet BMF pump standardization, the process chamber turbo pump shall be an Adixen ATH series pump.

5. Contain a high vacuum load lock system with a base pressure of 1E-5 Torr or less. This load lock shall:

a. Have a vacuum system containing a turbo pump backed by a shared oil-free, dry pump.

i. This vacuum system shall be able to be pumped independently from the process chamber vacuum system.

ii. To meet BMF pump standardization, the load lock chamber turbo pump shall be a Pfeiffer HiPace series pump.

b. Have a vacuum valve between the load lock and the main sputter chamber.

c. Have appropriate gauges to measure the pressure.

d. Be able to automatically hold and transfer a total of six substrates and/or shadow masks from a load lock cassette to the main sputter chamber (and transfer back into the load lock for holding).

e. Have the ability to load 150 mm and 3-inch SEMI spec wafers and shadow masks into the process chamber (and unload back into the load lock).

f. Have the ability to load substrates from chips to 150 mm SEMI spec wafers with the use of adaptors (and unload back into the load lock).

6. Include appropriate interlocks to ensure that the tool is safely operated.

7. Be constructed with gas lines and connectors that are suitable for handling Ar, O2, and N2 gases.

8. Be controlled by software that can manage all aspects of the tool.

This software must also provide users a Graphical User Interface (GUI) that: shows users the state of the tool (such as valve positions and pressure), allows users to change the state of the tool, allows users to create and store recipes, and allows users to run recipes to run process on the tool automatically. Additionally, it must be able to save a log file of deposition runs.

9. Include all computer systems, power supplies, chillers, and/or heat exchangers (if necessary) and all ancillary equipment required for the system to operate.

10. Include a standalone water-to-water heat exchanger (water-cooled chiller) that can provide the necessary cooling power required for the system if any cooling water is required. The Government requires the ability to be able to isolate any fluid cooling that the tool requires from the rest of the building process chilled water loop.

11. Include the ability to deliver the following process gases:

a. Ar

b. O2

c. N2

12. Include a separate mass flow controller (MFC) and a valve after the MFC for each process gas.

a. The MFCs for O2 and N2 must have a response time equal to or less than 50 ms.

13. Include a gas injection ring at the perimeter of the substrate.

14. Include a gas handling system that enables:

a. Anyone combination of gas to flow to any combination of sputter sources and/or injection ring (where each sputter source and/or injection ring receives the same gas mixture).

b. Ar gas to flow to any combination of sputter sources, while O2 gas and/or N2 gas flows to the injection ring.

15. Be able to generate an RF plasma and/or substrate bias using an automatically matched 100 W power supply.

16. Include six circular water-cooled magnetron sputter sources capable of sputtering from 4-inch diameter magnetic targets

a. Three of the sources shall have “normal” strength magnets, and three sources shall have “high” strength magnets (for magnetic targets).

b. Each sputter source shall have a shutter.

c. A spare shutter shall be provided for each sputter source

(total of 6 spares).

d. Any component that needs to be removed in order to change a sputter target shall be provided as a spare (i.e., ring clamps, chimney, etc.)

17. Include chamber shields in the main vacuum space to keep the majority of sputtered material from hitting chamber walls.

a. The shields must be removable without the use of a tool (by hand).

b. A set of spare shields shall be included.

18. Include one 6 kW HiPIMS power supply that is controlled by pulse peak current. In addition, the HiPIMS power supply is connected to a software-controllable switch to select the desired magnetron source.

19. Include one 2 kW DC pulsed power supply that is connected to a software-controllable switch to select the desired magnetron source.

20. The system shall be able to co-sputter simultaneously from two different sources using both the HiPIMS and DC pulsed power supply.

21. The system shall be able to rotate the substrate, apply RF bias to the substrate, heat the substrate to 600 C, and sputter all at the same time for a continuous period of no less than 24 hours.

22. Be able to control the substrate temperature to any temperature between 80 C and 600 C to an accuracy of ± 2 C while the substrate is rotating on the platen in the process chamber.

a. The system and heater must be compatible with 5% O2 during heating at a pressure of 133 Pascal (1 Torr) for a period of 24 hours due to a water-cooled shroud.

b. All the outer chamber walls must remain cool enough to prevent users harm if touched.

c. The system must be able to sputter deposit continuously at 600 C for a minimum of 24 hours.

23. Be able to rotate the substrate at a rate of 0-30 rpm.

24. Be able to load substrates with a size range of chips to 150 mm

SEMI spec wafers from the load lock to the process chamber (and back) without changing the parts in the load lock or process chamber. This can be accomplished by the use of either single or multi-wafer or chip carriers and/or adaptors.

a. The Contractor shall supply all parts required to load, transfer, and process 3 inch and 150 mm SEMI spec wafers with the system.

25. Contain a method of depositing through a shadow mask onto a 150 mm or 75 mm diameter substrate. The shadow mask must be loaded separately from the substrate and interchangeable automatically.

26. Contain a method of masking a 3-inch diameter substrate region:

a. To selectively deposit on user-defined regions of the substrate, rows (y) or columns (x), while rotating.

b. To create graded or wedge (moving mask) depositions of material in at least 2 orthogonal directions (x & y), while rotating.

c. Deposit through a shadow mask on to the substrate and selectively deposit on user-defined regions of the shadow mask, while rotating and at 600 C.

27. Contains an integrated method that allows for the easy removal of the masking shutter assembly without the use of tools for deposition on 150 mm diameter substrates.

28. Include a quartz crystal microbalance to monitor film deposition rate, with software-controlled positioning with at least 2 positions:

near center of substrate (for measuring) and away from the substrate (when not in use).

29. Be able to deposit metallic sputtered films such as W and Fe on substrates from chip sizes to 150 mm SEMI spec wafers.

30. Be able to deposit reactively sputtered films from a metal target and a reactive gas such as O2 or N2 to yield oxide or nitride films such as Al2O3, AlN, MnCoNiOx, and VOx on substrates from chip sizes to 150 mm SEMI spec wafers. The system will control reactive sputtering by adjusting the gas flow rate according to voltage (on sputter gun) based feedback.

31. To demonstrate that the system can deposit high-quality films, the system shall be able to deposit the following films on a silicon wafer to the following specifications:

a. To clarify NIST define the following terms:

i. Thickness uniformity is defined as (Range / (2 *

Average) ) * 100 % and will be measured by a stylus profilometer.

b. Film 1: W on a silicon substrate

i. Target thickness: 100 nm ± 10 nm

ii. Thickness uniformity: ± 5% on a 150 mm wafer and ± 3% on a 3” inch wafer, not including a 4 mm edge exclusion zone.

c. Film 2: AlOx reactively on a silicon substrate

i. Target thickness: 100 nm ± 10 nm

ii. Thickness uniformity: ± 3% on a 3-inch wafer, not including a 4 mm edge exclusion zone.

32. The sputter deposition system shall be able to fit in a space that is defined in attachment 1. Specifically, the system, along with any auxiliary equipment including but not limited to: electronics racks, vacuum pumps, water chillers, heat exchangers, and gas boxes, must be able to fit in a space of 6 feet deep, 8 feet wide, and 8 feet tall in a class ISO 5 clean space and a 6 feet deep, 8 feet wide and 8 feet tall space in a mechanical chase. The proposed layout must include space for all door swings, etc.

a. Include integration/bulkhead walls such that the tool will reside in a service chase. The load lock and main vacuum chamber will be accessible with doors that open into the cleanroom space. An additional door on the main vacuum chamber will allow for access via the service chase. The computer and monitor will be accessible in the clean space.

33. Be able to be powered using 120 V or 208 V, single or 3-phase power source(s). The Government reserves the right to define the tool voltage at a later time.

a. The Contractor shall supply a plug to power the system.

iii. Before shipping the system, the Contractor shall provide the Government a factory acceptance report demonstrating that the sputter deposition system performs according to tool specifications listed in this statement of work. The Government reserves the right to be present during the factory acceptance test. The Contractor shall provide the Government with a schedule of the factory acceptance test at least 4 weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory. During the factory acceptance test, the only films the Government requires a demonstration of is the deposition of the films listed in 2.c.ii.33 (NIST will supply sputter targets). The tool must be able to meet all other specifications in 2.c.ii. The tool must meet these conditions before it is shipped. The Contractor shall be responsible for providing the process gasses required for the demonstration.

iv. The Contractor shall be responsible for delivering the sputter deposition system to its final location in the BMF (Building 81, room 1B100).

This is to include all required rigging from the delivery truck to the final tool placement in the BMF. The installation and rigging shall be performed in a method that is compatible with the cleanliness requirements of ISO class 5 cleanroom and NIST structural requirements.

Items entering the cleanroom shall be cleaned to standards outlined in ISO 14644. The Government reserves the right to have the tool delivered to its final location in the BMF and then be able to facilitize the tool for a period between tool delivery and site acceptance test. This time period shall be at least 4 weeks and will not exceed 12 weeks, and the actual time period will be agreed upon between the Government and the Contractor. If facilitization occurs faster than the agreed-upon time period, then the Contractor may start the site acceptance test on a date that is mutually agreeable between the Government and the Contractor.

v. During tool installation, the Contractor shall provide a working set of standard recipes that will deposit the materials listed in section 2.c.ii.

along with appropriate cleaning recipes.

vi. After tool installation, the Contractor shall demonstrate the sputter deposition system performs according to tool specifications using a standard site acceptance test. This test shall include demonstrating that the tool can deposit the materials (NIST shall provide the targets) listed in section 2.c.ii. The Government will provide the process gases and silicon wafers required for this test. The tool must meet the stated performance requirements before it will be accepted. Measurement will be done with a stylus profilometer at three different points (equally spaced across the diameter) across a 150 mm wafer.

vii. After the tool passes the site acceptance test, the Contractor shall provide two days of on-site applications training.

viii. The Contractor shall supply the installation manual, utility requirements, and a diagram showing the tool footprint, measurements, and wall penetrations along with Request for Quotation.

ix. After award of contract, the Contractor shall supply a schedule for when the required work will be performed.

x. The Contractor shall supply all parts, hardware, equipment, and labor required to perform the tasks listed.

xi. The Contractor shall supply a one-year warranty on all parts and labor.

xii. The Contractor shall schedule all visits to the BMF with the TPOC at least 2 weeks before arriving at the site.

xiii. Within one week of the completion of the work, the Contractor shall provide the TPOC a report of the work done, the results of the acceptance test, and any issues identified.

3. Period of Performance:

a. The Contractor shall supply evidence of supplying similar sputter deposition tools and the installation manual along with the quotation. The Contractor shall supply a schedule for the required work within 4 weeks after receipt of (ARO) award.

The Government will provide the opportunity for a site visit within 4 weeks ARO.

The Contractor shall provide the Government with a schedule of the factory acceptance test at least 4 weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory. Before the tool is shipped, the Contractor shall provide the Government with a written factory acceptance report by email, demonstrating that the sputter deposition system performs according to tool specifications. The Contractor shall ship the tool within 40 weeks of award of contract. After the tool is placed in its final location in the BMF, the Government will take a minimum of 4 weeks and a maximum of 12 weeks to install and connect facilities to the tool. Within two weeks after the Government installs the tool, the Contractor shall have commissioned the sputter deposition system such that it passes the site acceptance test, and users are trained on the operation of the tool. Within one week of the completion of the work, the Contractor shall provide the TPOC a report of the work done, the results of the acceptance test, and any issues identified. After the Government receives the report, the tool shall be accepted. The Contractor shall provide a 1-year warranty after acceptance.

4. Place of Performance:

a. All work shall be performed at the 325 Broadway, Boulder, Colorado, Building 81, room 1B100.

b. The Government will provide access to Building 81 to the Contractor for the entire period of performance of this contract.

c. The day-to-day supervision and direct control over the work performed by the on-site Contractor personnel shall be the sole responsibility of the Contractor.

5. Government Furnished Property:

a. The Government will provide the opportunity for the Contractor to perform a site visit to ensure:

i. It is the Contractor’s responsibility for delivery of the tool to building 81, room 1B100. The tool must be able to be delivered to its final position in the BMF from the Building 81 dock. This should include ensuring that the tool can travel through all required hallways, doorways, and elevators.

ii. That the tool will be able to fit in the required space in the BMF as required by section 2.b.i.5.

b. After the site visit, it is the Contractors responsibility to ensure that the tool can meet the required specifications in section 2.c.ii.

c. The Government will facilitize the tool during a time period of at least 4 weeks but not to exceed 12 weeks after the tool is delivered to the BMF. The Contractor may provide a facilitization checklist for the Government to fill out and sign.

d. The Government will provide the appropriate process gases for the site acceptance tests.

e. The Government will provide appropriate sputter targets for the factory acceptance testing and the site acceptance testing.

6. Deliverables –

Specification Number Reference

Description Due Date Format (if applicable)

2.b.i.1 Provide evidence of experience of suppling, installing, and training new users on a sputter deposition system with similar requirements to those in the statement of work. Evidence of this criterion shall be demonstrated with an appropriate reference.

With quotation Electronic (PDF, .doc, .docx, etc.)

2.c.ii.28 The Contractor shall provide either measurement data from a similar tool or provide samples from a similar tool that the Government will measure of films that meet these specifications.

With quotation Electronic (PDF, .doc, .docx, etc.)

or physical samples

2.c.x Provide the Government with the installation manual, utility requirements, and a diagram showing the tool footprint, measurements, and wall penetrations along with quotation. The Contractor may provide a facilitization checklist for the Government to fill out and sign.

With quotation Electronic (PDF, .doc, .docx, etc.)

2.c.xi The Contractor shall supply a schedule for when the required work will be performed.

4 weeks ARO. Electronic (e-mail, PDF, .doc, .docx, etc.)

5.a The Government will provide the opportunity for the Contractor to perform a site visit

4 weeks ARO. N/A

2.c.iv The Contractor shall provide the Government with a schedule of the factory acceptance test at least 4 weeks prior to the test to ensure that the Government has enough time to arrange for travel to the factory.

4 weeks before factory acceptance test

Electronic (e-mail, PDF, .doc, .docx, etc.)

2.c.iv The Contractor shall provide the Government a factory acceptance report demonstrating that

Before the tool is shipped

Electronic (e-mail, the sputter deposition system performs according to tool specifications.

PDF, .doc, .docx, etc.)

2.c.v The sputter deposition system is delivered to its final place in the BMF

40 weeks ARO N/A

2.c.vi The Contractor shall provide a working set of standard recipes that will deposit the materials listed in section 2.c.ii. along with appropriate cleaning recipes.

During site acceptance

Recipes provided in the tool database

2.c.vii The Contractor shall demonstrate the sputter deposition system performs according to tool specifications using a standard site acceptance test.

54 weeks ARO. N/A

2.c.xv The Contractor shall supply the TPOC with a copy of a report summarizing, work done, the results of the acceptance test, and any issues identified within one week after their site visit.

55 weeks ARO. Electronic (e-mail, PDF, .doc, .docx, etc.)

2.c.xiv The Contractor shall schedule all visits to the BMF with the TPOC at least 2 weeks before arriving at the site.

N/A Electronic (e-mail, PDF, .doc, .docx, etc.)

a. Performance requirements:

i. Task: Assist the Government by supplying, setting up, and training new users on a sputter deposition system that meets the specifications as defined section 2.

ii. Performance Indicators: After the sputter deposition system is installed and tested, it meets the tool requirements described in section 2.

iii. Performance Standards: The technical requirements defined in section 2, the Contractor shall provides 2 days of tool training, and the delivery of the report described in section 6 within one week of completion.

iv. Acceptable Quality Level: Set up and testing of the sputter deposition system is performed according to industry standards. After the sputter deposition system is installed, it meets the tools’ requirements described in section 2.

7. Attachments:

a. Attachment 1: layout.png

8. Travel:

a. The Contractor shall be responsible for all travel expenses.

9. Contractor Supplied Materials

a. The Contractor shall supply all parts, hardware, equipment, and labor required to perform the tasks listed.

10. Contractor’s Minimum Qualifications

a. The Contractor shall:

i. Provide personnel that pass required government background checks to be issued badges for work on site.

11. Confidentiality:

a. The information developed under this contract is the property of the US Government and shall be kept in strict confidence.