68-5070-16_Technical_specification.docx

Technical specification for sputter deposition chamber General description

· The chamber is designed for use with the sputter targets oriented parallel to the sample surface; this configuration is optimal for “lift-off” patterning and allows the highest deposition rates.

· The distance between sputter target and sample surface is adjustable by translating the sample up to 3”. Longer source-target distances optimize uniformity and are preferable for lift-off, whereas shorter distances provide higher deposition rates.

· Three (3) sputter sources with 2” targets are included.

· Specimen holders will accommodate flat specimens of any shape and up to 2” diameter

· A load-lock is included to speed the time needed to load substrates.

· The deposition process is computer controlled, including heating steps and multiple deposition steps from different sources. The vendor is to provide a computer running the windows operating system, control software, and electronically actuated components.

NRL-provided equipment NRL currently owns the following items and will provide them for use with the new system. The vendor shall provide compatibility and mounting space for these items.

· 1 AJA DCXS-750-4 DC power supply.

· 1 AJA 100/300 MM3X RF power supply and manual matching network.

· 1 MKS e-Vision General Purpose Residual Gas Analyzer (RGA) mounted on standard 2.75” conflat flange. The RGA requires a computer running the Windows operating system; the computer supplied by the vendor is to be used for this purpose.

· 1 recirculating water chiller

NRL-provided utilities

· Compressed gases as required for sputtering processes (typically Ar, N2, O2)

· Compressed air at 60 psi

· 60A 220V three phase power Chamber specifics

· The chamber, load-lock and electronics must be mounted on a frame with wheels.

· All components must be easily accessible.

· The footprint of the system is not to exceed 44”x110”.

· The height of the system must not exceed 82”

· The deposition chamber is cylindrical, 15” high and 18” tall, constructed from electropolished 304 stainless steel

· Most flanges shall be sealed with standard conflat (CF) flanges, except chamber top sealed with viton o-ring for light weight and easy disassembly

· Top flange housing the sample holder mechanism shall be lifted and rotated using a built-in hoist to allow access to the chamber interior including the sample holder and translator mechanism.

· The chamber shall include four (4) 6” od CF ports oriented vertically at the bottom of the chamber. Three of the four ports will be populated with sputter sources. The fourth port will be available to accommodate an additional deposition source (not included).

· The chamber shall include six 6” CF ports located with their axes intersecting the center of the chamber at the sample height. Two of these ports shall be fitted with viewports with magnetically-coupled shutters, such that the specimen holder, sputter source, and plasma can be viewed during deposition. The other four 6” CF ports will be fitted with blank flanges.

· A turbo-molecular vacuum pump shall be mounted on the main chamber horizontally using an 8” CF flange. The pump shall provide pumping speed at least 650 l/s for Ar and O2 and with exhaust pressure at least 5 torr. The turbo pump should be equipped with an inert gas (N2) purge line and remotely actuated valve such that the purge gas can be turned on under computer control. NRL prefers the Pfeiffer HiPace line in order to be compatible with existing pumps and cables.

· The turbo pump will be paired with an oil-free/dry backing pump having pumping speed at least 10 m3/hr at 1 torr and ultimate pressure less than 0.1 torr.

· A throttling gate valve, pressure sensor, and controller shall be provided and placed between the chamber and turbomolecular pump, such that the conductance of the valve is adjusted dynamically in order to maintain a preset chamber pressure during sputtering. The valve shall be capable of closing completely when the chamber is vented such that the turbo pump can remain at full speed when the chamber is vented.

· The chamber shall be equipped with vacuum gauges for high vacuum (nude ion gauge), low vacuum to atmosphere (convectron gauge), and linear & gas independent gauge (capacitance manometer) with pressure range 0-100 mTorr.

· The chamber shall be equipped with two sets of gas lines, shutoff valves and mass flow controllers

Load Lock The load lock chamber volume and internal area should be minimized for fast pump-down. The assembly must include a high vacuum gate valve into the main chamber, up to air valve, viton sealed loading door, magnetic transfer arm, vacuum gauges, and high vacuum turbo-pump and backing pump. The chamber and gate valve must be large enough to accommodate specimens up to at least 6 mm thick as well as the specimen mounting plate. The pressure in the load lock should reach 1E-6 torr or less.

Sputter Sources

· Three UHV compatible sources mounted on conflat flanges, oriented vertically

· Each source equipped with individual shutter, chimney, and gas introduction ring

· Compatible with both RF or DC power supplies including AJA DCXS-750-4 DC power supply

· Gas lines, shutoff valves and mass flow controllers supplied for two gases

· Easy disassembly for target exchange via target clamp upon removal of the conflat flange

· Magnets located in vacuum (not in contact with water)

· Magnets easily removed/replaced

· Each magnet may be inserted with either pole facing the target such that the magnetic field pattern can be manipulated to suit the application

· The source magnets shall be fabricated from materials able to withstand temperatures to 200C without degradation.

· Cooling design sufficient to allow continuous sputtering at 100W without overheating Sample holder

· Accomodate samples of any size up to 2” diameter using mechanical fasteners

· May be located under any one of the deposition sources at normal incidence. Sample position must be motorized such that multiple targets can be utilized under computer control.

· The distance between the sputter sources and sample surface must be adjustable from near zero to 3”

· Provide heating to 1000C

· Water cooled reflector housing to prevent excessive radiation during sample heating

· Integral cooled mount for quartz crystal thickness monitor

· Sample table must allow transfer through a load lock

· Must be isolated to allow RF and DC bias

· RF power supply for sample must be included Control electronics The system shall include a computer, software and all electronics needed to actuate and control the sputter process, including deposit thickness and rate control, sample heating and temperature, sample positioning, source shutter actuation, source power supplies, gas supplies, gas pressure. The system will provide a means of controlling each of these components manually.