SOW_19-9C6_Nanometer_Probing_System_18Mar2019_POapproved.pdf

STATEMENT OF WORK (SOW)

DMEA 19-9C6

18 March 2019

Project Engineer: Daric Matthew Guimary, DMEA/MECC, (916) 999-2731

1.0 SCOPE:

1.1 TITLE: Nanometer Probing System

1.2 APPLICABILITY: Defense Microelectronics Activity (DMEA), Semiconductor Assurance Forensics Engineering (SAFE)

1.3 BACKGROUND: Transistor characterization and modeling are essential in today’s Failure Analysis (FA) lab.

Due to small geometries in the semiconductor industry, probing a device inside a Focus Ion Beam (FIB) is required for electrical characterizations and failure analysis techniques. The acquisition of a nano-prober will allow engineers in MECC to precisely place multiple probes on the target contact. Using contacts, or vias, which are less than a micron in diameter to characterize a transistor will minimize the damage created by FIB editing. This will increase the yield of characterizing multiple transistors, as well as reducing the usage of the FIB and consumables.

1.4 PURPOSE: To purchase a nanometer probing system that is compatible with SAFE’s FIB.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.5 GOVERNMENT FURNISHED FACILITIES/ACCESS:

Facility/Access Date Building 620, Room 134 ARO

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

3.1.1 RESERVED

3.2 PROGRAM MANAGEMENT: None

3.3 TASK REQUIREMENTS:

3.3.1 NANOMETER PROBING SYSTEM: The contractor shall provide a nanometer probing system that includes the following:

3.3.1.1 TIP CONTACT DETECTION: The nanometer probing system shall have the capability of alerting the user when the probe tip has made contact with the sample by means other than visually observing physical contact.

3.3.1.2 PROBE CAPACITY: The nanometer probing system shall have at least six (6) probers, with the ability to be expanded to at least eight (8) in the future.

3.3.1.3 PROBE DRIFT: The nanometer probing system shall have a drift of less than 1nm/minute.

3.3.1.4 PROBE POSITIONING: The nanometer probing system shall have an X-Y axes positioning resolution of 1.5nm or less. The nanometer probing system shall have a Z axis positioning resolution of 5nm. The nanometer probing system shall have the capability of moving each probe independently from one another. The nanometer probing system shall have the capability of gripping a FIB lamella sample.

3.3.1.5 SOFTWARE: The nanometer probing system shall have Software that enables the user to control all of the probes independently. The Software shall allow the user to perform the Failure Analysis Capabilities described in paragraph 3.3.1.6.

3.3.1.6 FAILURE ANALYSIS CAPABILITIES: The nanometer probing system shall have Electron Beam Induced Current (EBIC), Electron Beam Absorbed Current (EBAC), IV Curve measurement, and Resistive Contrast Imaging (RCI) capabilities, at a minimum.

3.3.1.7 COMPATIBILITY: The nanometer probing system shall be compatible with the FEI Helios NanoLab 660 and FEI Nova NanoSEM 650. The nanometer probing system shall be capable of remaining stable while the chamber stage tilts up to 52° e-beam/ion beam eucentric position without coming into contact with any of the other equipment inside the chamber. The nanometer probing system shall also be capable of operating outside of a beam tool chamber in ambient conditions. The nanometer probing system shall include vacuum electrical feedthrough hardware compatible with both the 650 and 660, including connectors and wiring to control the probes, stimulate the device under test and obtain low noise measurements without interfering with any other components in the chamber.

3.3.1.8 SUBSTAGE: The nanometer probing system shall have a substage or the ability to move the sample in the X, Y, and Z axes independent of the probes.

3.3.1.9 PROTECTIVE CASE: The nanometer probing system shall have a case that protects the system from environmental contamination when not in use.

3.3.2 DELIVERY: The contractor shall deliver the nanometer probing system to the DMEA POC listed in paragraph 4.0.

3.3.3 INSTALLATION: The contractor shall install the nanometer probing system in the FEI Helios NanoLab 660, scheduled for a time agreed upon by both DMEA and the contractor. The contractor shall verify that the nanometer probing system is operating at a level that meets or exceed the stated specifications.

3.3.4 TRAINING: The contractor shall provide on-site training to DMEA after the installation is complete, referred to in 3.3.3.

3.3.5 WARRANTY: The contractor shall provide on-site hardware and software warranties covering manufacturing defects for a minimum one (1) year. The contractor shall maintain the equipment provided in paragraph 3.3.1, including the repair or replacement of any failed components, under normal operation, that negatively impact the intended operation of the equipment.

3.3.6 DOCUMENTATION: The contractor shall provide off-the-shelf user/operating manuals for the item described in paragraph 3.3.1.

3.4 PROGRAM SUMMARY: None

4.0 POINTS OF CONTACT:

DMEA/MECC Project Engineer:

Daric Matthew Guimary Address: 4234 54th Street McClellan, CA 95652-2100 Voice: (916)999-2731 E-Mail: daric.guimary@dmea.osd.mil