Purchase Description.pdf

569 EMXS/MXDP Printed Circuit Board Manufacturing Facility 18 Aug 2011

Purchase Description

Competit ive Procurement of a Printed Circuit Board (PCB) Automatic Optical Inspection Machine

I. Specifications

a. Scope - The Automatic Optical Inspection (AOI) Machine will inspect inner layers, outer layers and artwork for the manufacture of printed circuit boards.

b. Line width and spaces - minimum of 1.4 mils

c. Pane Size - minimum 30”X24”

d. Panel Thickness -2 to 200 mils

e. Tooling - Pin-less

f. Throughput – Minimum 200 sides per hour based on a panel size of 18”X24” and line widths and spacing of 4 mils.

g. Copper Inspection - DSTF, Double Treated Foil, Plated Copper

h. Low Contrast Inspection - Shall be capable of inspecting low contrast materials such as

DSTF, Double Treated, Teflon and Rogers

i. Photo Resist Inspection – Shall be able to inspect photo resist after developing

j. Defect Verification – Defects must be able to be verified on the AOI and not have to be transferred to another machine for verification

k. Local Measurements – Shall be able to measure pads, lines or distance between two points

l. Error Detection – Shall detect opens and shorts, nicks, mouse-bites, protrusions, pin holes, islands, dish-downs, line/space violations, annular ring violations, extra features and missing features.

m. Power Requirements - 208V, 60H, 3 phase, max 200 amps

n. Maximum Size- Shall fit through a door 70” wide by 83” tall

o. Maximum Air Pressure requirements - 90PSI

p. Data Input – Required input files shall be able to be exported from CAM350 and imported into the AOI without the need to purchase additional software to manipulate the input files into a format the AOI can accept.

II. Installation

a. Delivery and set-up of machine shall be within 10 weeks after receipt of order.

b. This installation requires the contractor work in a controlled area and therefore must submit a Visitor Authorization Request to the Avionics Visitor Control Center (B624) at least 24 hours prior to the visit. The request must be in writing (mail, email, or fax) from the contractor on company letterhead.

c. The machine shall be shipped directly to the B640 loading dock.

d. The machine shall be installed by a qualified OEM technician onsite of the 569

EMXS/MXDP Printed Circuit Board Facility in Room Number 1148 of Building 640

(annex).

569 EMXS/MXDP Printed Circuit Board Manufacturing Facility 18 Aug 2011

e. Room 1148 currently has 120V / 60 Hz / single phase and 208V / 60 Hz / 3 phase power.

The contractor shall specify any other facility requirements for the machine prior to shipment.

f. The contractor shall provide all fluids/oils/etc. necessary for machine operation.

III. Training

a. After installation, the contractor shall provide onsite training to government personnel that will cover all aspects of machine operation including, but not limited to, data input and prep, inspection setup and execution using customer supplied innerlayers, panels and artwork. Basic troubleshooting and maintenance shall also be included.