DARPA-SN-26-94.pdf

Request for Information (RFI)

DARPA-SN-26-94

Infrared Focal Plane Arrays Responses Accepted: Until 5:00 PM Eastern Time (ET) on August 14, 2026 Point of Contact: DARPA/STO Email Address: DARPA-SN-26-94@darpa.mil

1.0 Introduction and Purpose

The Defense Advanced Research Projects Agency (DARPA) is issuing this Request for Information (RFI) to identify and gather information on the state-of-the-art of Infrared (IR) Focal Plane Arrays (FPAs) and alternative technologies. This RFI seeks to survey the industry for available and emerging solutions, understand current capabilities, and identify key performance parameters of systems relevant to advanced sensing applications. The information gathered will be used for market research and to inform potential future program developments. This RFI is solely for information gathering and planning purposes. It does not constitute a solicitation for proposals, abstracts, or quotations nor indicate an intent to fund those who respond with a future contract award.

2.0 Background

DARPA is continually exploring technologies that provide revolutionary new capabilities to the warfighter. DARPA is interested in understanding trades of cost and area coverage for IR (3-14μm) staring (2-D) and scanning (TDI) focal plane arrays, where the principal axes are FPA size, number of systems, and total procurement cost for an operational capability. We are requesting information on FPAs to inform future systems. All relevant aspects of FPA performance are requested to ensure fair comparison of similar devices. These next-generation sensors may be integrated into a wide range of platforms in terrestrial, maritime, air, and space domains.

3.0 Scope of Interest

This RFI is interested in two primary categories of technology:

1. Infrared Focal Plane Arrays (FPAs): We are seeking information on all types of IR FPAs, including but not limited to staring and scanning arrays, cooled and uncooled detectors, analog and digital ROICs, and any suitable detector material (e.g., HgCdTe, InSb, InGaAs, VOx, Type-II Superlattice). Information is sought for focal planes spanning all the wavelengths from 3μm to 14μm. We are also interested in the readout capabilities, to include global shutter, rolling shutter, and time delay and integration (TDI) readouts.

Emphasis is placed on devices that are sufficiently mature for system integration.

2. Alternative Technologies: We are also interested in any alternative or emerging sensor technologies that perform a similar function to IR FPAs for detecting and imaging infrared radiation. Respondents should provide comprehensive details on these technologies, highlighting how they differ from traditional FPAs and what advantages they may offer.

Please list performance parameters characterizing the device in a manner similar to the below table.

4.0 Information Requested

Respondents are requested to provide information for each relevant product or technology. The table below is provided for reference, but contractor format is permitted. Please structure your response to address the listed parameters. Use separate tables for each distinct product or product line. List discrete options for product lines where applicable (e.g. similar FPAs offered in different sizes) and price independently. This table may not be exhaustive. If needed, please list additional features and capability/performance impact.

4.1 Company Information

Information Requested Response

Company Name

Company Location (HQ)

Company Size (Total Employees)

Company Size (Annual Revenue, USD)

Primary Point of Contact (Name, Title, Email, Phone)

4.2 Technical Specifications

Parameter Response / Value

Product Name / Model

Technology Type (e.g., Cooled MCT FPA, Uncooled VOx Microbolometer)

Wavelength Range independent of filtering (µm)

[Framing] Array Format (Horizontal x Vertical Pixels)

[Framing] Max frame rate

[TDI] Array Format (Line Width x stages)

[TDI] Min/Max Line Rate

Horizontal Pixel Pitch (µm)

[Framing] Pixel Pitch (µm)

[TDI] Scanning direction Pixel Pitch (µm)

[TDI] Cross-scan Pixel Pitch (µm)

[Framing] Well depth (# e-) per pixel

[TDI] Well depth (# e-) at output

Required cooling power (W)

Acceptance angle, if microlensed

Fill factor accounting for microlensing

Operating Temperature Range (°C)

Focal Plane Array Size (mm x mm)

Power Requirement (Watts)

Quantum Efficiency @ 100nm increments

Maximum Frame Rate (Hz)

ROI capability

Binning capability

[Framing] Min/max Integration Time

Readout IC (ROIC) Architecture (e.g., CTIA, DI, SFD)

Read noise (# e-)

Dark current (A)

% Operable pixels

Price in quantities of 10, 100, and 1000, and 10,000

For focal plane damage sensitivity estimation purposes, best estimate of Watts per pixel required to damage while powered

Similarly, best estimate of Watts per pixel required to damage while unpowered

Other Key Performance Parameters Please list and describe any other relevant specifications

4.3 Narrative Responses

Responses with just the above will be substantially helpful. If time permits, provide brief narrative responses to the following questions where applicable:

1. Describe the maturity of the device (e.g., concept, prototype, in production).

2. Describe the integration of this focal plane into a full camera, including readout, dewar, cold stop, and lens.

3. Describe the focal plane non-uniformity, the timescales at which it changes, and the linearity of its correction.

4. Describe current production rates and prospects for scaling.

5. Describe the environmental applicability/limitations (e.g. maritime, terrestrial, airborne, spaceborne).

6. Describe the product’s primary market.

7. Describe any key differentiators or unique advantages.

8. For non-traditional FPAs, describe its fundamental operating principles.

5.0 Submission Guidelines

• Format: Responses should be submitted in PDF format using 12-point font, single-spaced, 8.5 by 11-inch paper, with 1-inch margins.

• Length: There is no page limit, but concise responses are encouraged.

• Cover Sheet: Your response must include a coversheet with the information requested in section 4.1.

• Proprietary Information: Please clearly mark any proprietary information. The

Government will protect such information from unauthorized disclosure.

• Submission: Please email your response to DARPA-SN-26-94@darpa.mil with the subject line "Response to DARPA-SN-26-94". DO NOT INCLUDE ANY CLASSIFIED

INFORMATION IN THE RFI RESPONSE TO THIS INBOX.

• Deadline: All responses must be received by 5:00 PM ET on August 14, 2026.

• Classified responses, if any, are also of interest and have distinct submission instructions.

Send an email to DARPA-SN-26-94@darpa.mil indicating your intent to submit a classified response; DARPA will respond with follow-up instructions for the actual submission.

6.0 Disclaimer

This is an RFI issued solely for information and new program planning purposes; it does not constitute a formal solicitation for proposals. The Government does not intend to award a contract on the basis of the RFI or otherwise pay for the information requested; and responses will be treated as information only and not as a proposal. Submission is voluntary and is not required to propose to a subsequent solicitation (if any) on this topic. DARPA will NOT provide reimbursement for costs incurred in responding to this RFI. NO CLASSIFIED INFORMATION SHOULD BE INCLUDED IN THE RFI RESPONSE. It is the submitter's responsibility to clearly define to the Government what is considered proprietary data. Any proprietary information should be clearly labeled as “proprietary.” DARPA will disclose submission contents only for the purpose of review and evaluation. Respondents are advised that DARPA is under no obligation to acknowledge receipt of the information received or provide feedback to respondents with respect to any information submitted under this RFI.