Attachment A - Specifications.pdf

SPECIFICATIONS DILUTION REFRIGERATOR FOR QUANTUM SENSING

Specifications

DILUTION REFRIGERATOR FOR QUANTUM SENSING J1046K00

Rev. Date Description Originated By Checked By Approved By

07 MAR 2026

Initial Release

A. Galindo-Uribarri

Weijun Yao

Seppo Penttila

23 MAR 2026 Final Version A. Galindo-Uribarri Seppo Penttila

Post Office Box 2008 Oak Ridge, Tennessee 37831

(865) 574-6124 | uribarri@ornl.gov

Contents 1 Overview

2 Procurement Specification Requirements

3 Performance Requirements

4 Electrical Requirements

5 Thermometry, Heater and Wiring Requirements

6 Other Requirements

7 Required Testing

8 Design Verification and Approval Requirements

9 Quality Control Requirements

10 Shipping Requirements

11 Required Documentation

1 Overview

The Company seeks to procure a cryogenic system based on a dilution refrigerator capable of continuously maintaining temperatures below 10mK. This refrigerator will provide dedicated cryogenic infrastructure supporting workforce development and research in superconducting radiofrequency systems, optical device measurement, and quantum device design and development.

The system is intended to support training, experimentation, and measurement programs. This system will position the Company as a leader in training the next generation of the quantum science and engineering workforce, along with contributing to other research and development areas such as neutrino physics, quantum systems and entanglement-enhanced sensing.

The system should be based on a cryogen-free dilution refrigerator (DEVICE) that provide continuous cooling at ultra-low temperatures through the dilution process of helium3-helium4 mixture in a closed loop environment. The system should be modular with the cooldown and warm up sequences fully automated. The system should operate fully remotely allowing to conduct long-term, sensitive experiments safely. The system should include all the equipment necessary for the successful operation of the dilution refrigerator including the pumps, gas handling equipment, support electronics etc. The gas handling system should be intuitive, easy to use, with class-leading safety and reliability.

To accommodate large payloads a large space mixing chamber (MXC) with a flange of diameter of 500 mm is required. The dilution refrigerator mixing chamber plate should be able to hold a large payload weight of up to 500 kg. The length of the free space below the mixing chamber should be 500 mm. The radial space requirement is defined in 3.5.1 in Performance Requirements. The system should include a mixing chamber radiation shield with gold plating around the above defined empty volume.

The system should include a scalable qubit readout and control with the essential classical-to-quantum interfaces that drive and measure superconducting qubits. The qubit control system FPGA- platform based on AMD’s Radio Frequency System-on-Chip (RFSoC) should integrate firmware, software, and hardware.

This system shall be compatible with The Quantum Instrumentation Control Kit (QICK) developed by

Fermilab. Wiring should involve managing high-density RF connections (100 MHz – 10 GHz).

Any written correspondence between the SELLER and the COMPANY, initiated by the SELLER, shall be directed to the Company’s Procurement Officer.

2 Procurement Specification Requirements

2.1. A schedule that does not extend beyond 09/26/2026. Within this period, the SELLER shall complete all obligations related to the delivery of the DEVICE ASSEMBLY(S).

3 Performance Requirements

3.1. “Fully configured” is defined herein as a DEVICE ASSEMBLY in which all items are installed, integrated, and fully operational in their intended configurations, and in full compliance with all functional, electrical, optical, mechanical, interface and any other requirements specified therein.

3.2. “Base temperature” is defined herein as the mixing chamber MXC temperature achieved by the

DEVICE under “steady-state operation”

MXC

temperature

Cooling power available at fully wired/cabled MXC during steady-state operation at specified MXC temperature

20 mK >14 µW 100 mK >450 µW

The cooling power requirement is for setup where the large MXC radiation shield is in place.

3.3. The DEVICE shall be capable of continuously operating without the use of an external liquid nitrogen cold trap.

3.4. The DEVICE shall be capable of cooling from ambient room temperature to “base temperature” in under 30 hours when all wiring is installed in the DEVICE.

3.4.1. Provision for installation of active vibration isolation equipment. Please include in the SELLER quotation as an optional system to be considered.

3.5. When fully closed and assembled, the DEVICE shall provide:

3.5.1. A minimum of 240 mm of radial clearance measured perpendicular to the MXC centerline from the MXC center point to the innermost radiation shield. A minimum of 480 mm vertical clearance.

3.6. The DEVICE ASSEMBLY shall include a mounting frame suitable for operation of the DEVICE.

3.7. The DEVICE should be able to ingress/egress into a room door with a minimum of 84” height, 50” wide. COMPANY will provide a sketch of room layout and dimensions.

4 Electrical Requirements

4.1. The cryocooler compressors shall operate on 208 VAC 60 Hz 3-phase power.

4.2. All other components of the assembled DEVICE ASSEMBLY shall operate on 208 VAC 60 Hz 1-phase, 208 VAC 60 Hz 3-phase, or 120 VAC 60 Hz 1-phase power.

4.3. Grounding lugs (or other ports that can be connected to an external ground) shall be available on the top plate of the DEVICE and on the support stand of the DEVICE ASSEMBLY.

4.4. No sensors and/or heaters used inside of the DEVICE shall be grounded to the chassis of the

DEVICE.

5 Thermometry, Heater and Wiring Requirements

5.1. All plates within the DEVICE with nominal operating temperatures between 1 K and 250 K shall be outfitted with thermometry. All such thermometry shall be calibrated over the full temperature range encountered during each plate’s operation.

5.2. All heaters within the DEVICE shall be capable of simultaneous operation.

5.3. Additional wiring requirements: At least four RF coaxial lines shall be installed within the

DEVICE. Minimum 4 input / 4 output and the rest split 50-50 DC bias and flux bias.

5.4. All RF coaxial lines shall thermally terminate on the MXC plate.

5.5. Attenuations (in dB) for different line types. Use 0.086" coaxial stainless steel semi-rigid, BeCu center conductor cabling for everything but the output lines, which should be 0.086" coaxial NbTi cabling:

Cable Type 50K 4K 1K 100mK 10mK Input Line 0 20 6 10 30 Output Line 0 0 0 0 0 DC Bias Line 0 20 0 0 0 Flux Bias Line 0 20 0 0 10

5.6. All wiring shall be thermally anchored at every stage between the Outermost Vacuum Chamber plate and the location of the lowest temperature terminating connector.

5.7. At least forty-eight lines of DC wiring shall be installed within the DEVICE.

5.8. At least 2 optical fibers shall be installed

5.8.1. All optical fibers shall terminate on the MXC, on the side of the MXC between the MXC and the Dilution refrigerator still plate.

5.9. The SELLER shall provide drawings for all intermediate plate blanks or ensure a mechanism exists for the COMPANY to obtain replacements from the SELLER if needed.

6 Other Requirements

6.1. The DEVICE, excluding COMPANY customizations, shall be based on a previously built design implemented in a commercially offered system and demonstrated in operation to meet the published performance specifications for that system.

6.2. Any Helium-3 required for operation of the DEVICE shall NOT be provided by the SELLER.

6.2.1. The SELLER shall be responsible for supplying any Helium-3 required for the testing of the

DEVICE ASSEMBLY at the SELLER facility. Any Helium-3 added to the DEVICE ASSEMBLY for the purposes of such testing shall be removed by the SELLER prior to shipment of the DEVICE

ASSEMBLY to the COMPANY SITE.

6.3. The DEVICE ASSEMBLY shall be capable of being fully operated and monitored through a

COMPANY-supplied computer running a Windows 11 operating system using SELLER-provided control software. The SELLER-provided control software shall communicate with PLC(s) supplied as part of the DEVICE ASSEMBLY. The PLC(s) shall act as the sole interface to all equipment within the DEVICE ASSEMBLY, including, but not limited to valves, heaters, pumps, cryocoolers, heat switches, compressors, and sensors. Any such combination of computer and control software shall be able to:

6.3.1. Command the PLC(s) to actuate all automated or semi-automated valves, as well as all pumps, cryocoolers, heat-switches and compressors.

6.3.2. Command the PLC(s) to control all installed heaters within the DEVICE including adjustable power control of heaters used for temperature control.

6.3.3. Readout, log and plot, via the PLC(s), the position, state, and/or status of all items including, but not limited to:

6.3.3.1. Cryo Cooler (CC) status, CC cooling water inlet and outlet temperatures, CC helium temperatures, CC low and high side helium pressures, CC oil temperatures and any produced errors.

6.3.3.2. Any turbomolecular pump rotational frequencies, drive power and produced errors.

6.3.4. Readout, log and plot, via the PLC(s), any and all temperature, pressure and flow sensors installed within the DEVICE ASSEMBLY.

6.3.5. Pumps within the DEVICE ASSEMBLY shall meet the following requirements:

6.3.6. Pumps shall be commercially available, with designs not being specific to the SELLER or to the

DEVICE ASSEMBLY.

6.3.7. Pumps shall be sealed and appropriate for use with the working fluid.

6.3.8. The DEVICE shall feature one or more CC. Each CC shall comply with the following:

6.3.9. CC performance shall be comparable to that of a pulse-tube-style CC with external valve motor, a bellows interface between the CC and the DEVICE, and flexible copper braided straps between the stages of the DEVICE.

6.3.10. The gas handling system and any of its sub-components shall meet the following requirements:

6.3.11. Any and all valves used within the gas handling system shall be commercially available models whose successful previous usage can be demonstrated.

6.3.12. The gas handling system shall include provisions for storing, at sub-atmospheric pressure, the entire volume of the working fluid required for successful operation of the DEVICE.

6.3.12.1. Any fluid storage reservoir(s) provided shall include a manual valve installed between the fluid storage reservoir(s) and the first automated or semi-automated valve(s).

6.4. The DEVICE ASSEMBLY shall include an auxiliary (i.e. not used for circulating the helium working fluid) turbo molecular pump and backing pump combination for evacuation of the OVC space.

This pump combination shall be suitable for indefinite operation without overheating.

6.5. O-rings used to seal the OVC of the DEVICE shall be made from a fluorocarbon material such as

Viton.

6.6. All SELLER fabricated fluid handling components within the DEVICE ASSEMBLY shall be leak checked and certified to be leak-free at a level of 10-9 mbar L/sec.

6.7. Any flexible hoses used within the DEVICE or DEVICE ASSEMBLY shall be installed below their dynamic bend radius as specified their manufacturer’s literature.

6.7.1. Any tubing, hoses, flexible joints, expansion joints, vibration isolators, bellows, or similar compliant components utilized in the helium working fluid circulation path of the DEVICE

ASSEMBLY shall be made from metal.

6.8. The COMPANY prefers minimal use of rubber and KF seals within components used in any working fluid circulation path of the DEVICE ASSEMBLY.

6.9. Any and all KF flanges which can be subjected to pressures exceeding 0 psig in any operating condition, shall be installed with appropriately rated centering ring and chain clamp combinations.

6.10. The DEVICE ASSEMBLY shall be designed to tolerate unexpected electrical power interruptions or brownout conditions without damage to its components.

6.10.1. The DEVICE ASSEMBLY shall transition to a “safe state” after the restoration of power.

6.10.1.1. A “safe state” shall be defined as a state where, without the manual intervention of an operator, the DEVICE ASSEMBLY poses no reasonable safety risk to bystanders, potential damage to the DEVICE ASSEMBLY or any of its subcomponents, or potential loss of the working fluid.

6.11. The DEVICE ASSEMBLY shall be designed to tolerate unexpected cooling water interruption without damage to its components.

6.12. The DEVICE ASSEMBLY shall be designed to tolerate unexpected instrument air interruption without damage to its components.

6.13. The DEVICE ASSEMBLY shall be designed to tolerate unexpected controls/ communication interruptions or failures without damage to its components.

6.14. All items likely to require maintenance, repair, replacement or regular assembly and disassembly shall be easily and quickly accessible with a minimum 3 sides access without cutting or welding.

7 Required Testing

7.1.1. The SELLER shall demonstrate that the DEVICE ASSEMBLY meets the specifications by means of a full-scale DEVICE ASSEMBLY test at the SELLER facility.

7.1.2. The COMPANY reserves the right to be present during this demonstration and shall be notified at least three calendar weeks prior to the scheduled demonstration.

7.2. All wiring, thermometers and electrical connections shall be tested by the SELLER for electrical continuity and RF loss as appropriate.

7.3. The DEVICE ASSEMBLY shall undergo an independent, full-scale acceptance test at the

COMPANY SITE.

8 Design Verification and Approval Requirements

8.1. Voltage, current, frequency, phase, and SELLER-provided connection method for any electrical connections required for successful “steady-state operation” of the DEVICE ASSEMBLY at the

COMPANY SITE.

8.2. Detailed specifications for any external fluid services required for “steady-state operation” of the DEVICE ASSEMBLY at the COMPANY SITE, including, at minimum, fluid requirements, temperature, maximum pressure, flow rate and connection type/size.

8.3. Detailed Piping and Instrumentation Diagram (P&ID), containing within it all cryocoolers, vacuum pumps, other pumps, valves, relief valves, temperature sensors, pressure sensors and like instrumentation/equipment for the DEVICE ASSEMBLY.

8.4. Valve actuation sequences, along with detailed descriptions of such sequences, for all valves and equipment subject to automated processes, including, but not limited to cooldown, normal operation, working fluid recovery/warmup and any other sequences subject to automated control.

8.5. Documentation stating the response of all valves and equipment in events including, but not limited to the loss of electrical power, power resumption, loss of instrument air, loss of cooling water, internal circuit rupture, loss of cryogens, loss of insulating vacuum, contamination, control system failure, software/programming errors, pumping failures, cryocooler failure(s), fire, improper setting of manual or user-controlled valves and any other circumstance which reasonably constitutes a hazard under the prevailing conditions.

8.6. Manufacturer and model number of any thermometer readout electronics.

8.7. Values and materials of fixed attenuators on RF lines as described.

8.8. Outside dimensions of the DEVICE and DEVICE ASSEMBLY when fully assembled.

8.9. Clearances required for the disassembly and maintenance of the DEVICE and DEVICE ASSEMBLY.

8.10. Major drawings and 3D models in .stp format of the DEVICE ASSEMBLY, including layouts and bolt hole patterns of the CCP1, CCP2 and MXC cold plates.

8.11. 3He volume requirements of the DEVICE.

8.12. Quality Control Plan (QCP)

8.13. Manufacturing Inspection Plan (MIP)

8.14. A certificate of conformance affirming that the system, including its relief devices and the fluid flow paths upstream and downstream of such relief devices (from the pressurized equipment to the final point of discharge) are sized and installed to prevent pressures from exceeding design pressures for any circumstance that reasonably constitutes a hazard under the prevailing conditions including, but not limited to equipment failure, control failure, operator error, sustained heat loads, self-limiting heat loads and external sources of pressure, and, where applicable, loss of insulating vacuum to atmosphere or to the working fluid.

9 Quality Control Requirements

9.1. The SELLER shall prepare and implement a Quality Control Plan (QCP) covering the design, procurement, fabrication, testing and inspection of the DEVICE ASSEMBLY and its subassemblies.

9.1.1. The QCP shall provide for planning and execution of procurement activities in accordance with documented instructions and/or procedures.

9.1.2. The QCP shall provide for verification of conformance of purchased items to design specifications and procurement document requirements via mechanisms such as material certifications and/or material test reports.

9.1.3. The QCP shall provide manufacturing planning, material and process control, inspection and testing, non-conformance control and objective evidence (documentation) of the inspection function.

9.1.4. The QCP shall provide for calibration procedures and schedules, status indication on measurement and test equipment, serialization of test equipment, traceability to NIST or other accepted standards and calibration records for any temperature sensors, pressure gauges, and other calibrated measurement instruments within the DEVICE ASSEMBLY.

9.1.5. The QCP shall provide for qualifications of personnel and/or procedures for the performance of certain special processes. These include but are not limited to welding, heat treatment, non-destructive examination, helium mass spectrometer leak checking, or others as may be required by this specification or by the nature of the process or product.

9.2. The SELLER shall develop and implement a Manufacturing Inspection Plan (MIP) which identifies all required inspection and testing activities throughout the manufacturing process of the

DEVICE ASSEMBLY.

10 Shipping Requirements

10.1. All components included with the DEVICE ASSEMBLY shall be packaged and shipped appropriately to avoid any damage during transit.

10.2. All items shall be shipped within shipping crates.

10.3. All shipments shall be inspected by the COMPANY upon arrival at the COMPANY SITE. The

SELLER shall be responsible for ensuring the DEVICE ASSEMBLY and all its subcomponents arrive at the COMPANY SITE undamaged. Any damage done to the DEVICE, DEVICE ASSEMBLY, or any subcomponent during shipping shall be remedied at the SELLER’s expense. The COMPANY strongly recommends the SELLER purchase shipping insurance.

11 Required Documentation

11.1. SELLER shall provide documentation that any testing has been successfully completed, along with the results of this testing.

11.2. SELLER shall provide a detailed installation manual for the DEVICE ASSEMBLY.

11.3. SELLER shall provide a detailed operation manual for the DEVICE ASSEMBLY which shall specify amongst other things the cool-down procedure, the working fluid recovery procedure, any fault diagnosis procedures and service manuals.

11.4. SELLER shall provide specifications and calibrations for all instrumentation within the DEVICE

ASSEMBLY.

11.4.1. SELLER shall provide all documents required for safe handling, transport and shipping of the

DEVICE ASSEMBLY.

11.5. COMPANY shall provide room sketch and available utilities