SATPC0033964 Tab 04 4 SOW.pdf
PDF 123 KB Posted
- Solicitation number
- 80NSSC24858912Q
About this file
This document outlines specifications for a statement of work to fabricate printed circuit boards. It requires the delivery of eight fully functioning and tested PCBs meeting specific workmanship and fabrication standards, including ENIPIG plating, 100% netlist verification for opens and shorts, conductor widths within 0.001 inches of Gerber data, and surface mount pad plating flat to 0.003 inches. The fabricator must have experience with Ohmega-ply resistor material and realizing micro-via and mechanical drill designs within specified dimensions. Fabrication should be completed within 30 days of contract execution upon delivery of final design files.
The related federal contract opportunity is a special notice from the National Aeronautics and Space Administration Shared Services Center to fabricate a quantity of eight 64-element 5G phased array printed circuit boards meeting the specifications in the attached statement of work documents.
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Other files
| File | Type | Posted |
|---|---|---|
| SATPC0033964 Tab 07 Capability Statement FBO Posting.pdf |
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SPECIFICATIONS or STATEMENT OF WORK (SOW)
The FIGARO (5G Arrays for lunar Relay Operations) project requires, custom , advanced manufacturing of a printed circuit board design.
This fabricated circuit boards to be delivered shall:
• Deliver quantity:8 full functioning and tested PCBs
• Printed wiring board workmanship shall confirm to IPC-6018, Class2. Were applicable.
• Printed wiring board shall conform to IPC 6000 series, class 2 and IPC-6012, class
2 in accordance with IPC-2221.
• All exposed conductive pattern areas not covered with solder mask or plating shall be plated with Electroless Nickel Electroless Palladium Immersion Gold (ENIPIG) over copper in accordance with IPC-4556.
• 100% netlist electrical verification using customer supplied IPC-D-356 netlist for opens and shorts.
• Warp or twist of board shall not exceed 1%.
• Conductor widths and spacing shall be within +- 0.001” (0.03) of gerber data.
• Surface mount pad plating must be flat to a maximum of 0.003" (0.08) above surface.
• Fabricator must have experience with internal Ohmega-ply resistor material
• Fabricator must have experience in realizing designs with micro-via layers with laser drills of 4 mil diameter and 2 mil annular rings as well as 6 mil diameter mechanical drills with 4 mil annular rings.
• Fabrication should be completed within 30 days of PR execution and delivery of materials.
• Fabrication will not commence until the final design files have been sent to the fabricator
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