Q&A.pdf
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- Laser Direct Imaging Unit for Photolithography
- Solicitation number
- 80NSSC19Q0677
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| File | Type | Posted |
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| -_Spec.pdf | ||
| RFQ.pdf |
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Solicitation #80NSSC19Q0677-Laser Direct Imaging Unit for Photolithography
Q) We have some basic questions:
Bungard: The Direct Imager in the RFQ is listed as a Bungard LaserPro 3000
- We assume we are to quote an equivalent or better.
- Bungard Website: https://www.bungard.de/index.php/de/produkte/fraesbohrplotter/uv-laserdirektbelichtung
- Issue: Their system is in no way comparable in technology level or pricing to our system.
o Specification : Your specification shows a line width of less than 2000 micrometers (.078 inches) which is very, very large for a system like ours, but not a problem.
o Specification: Is there an accuracy requirement to the feature size?
o Laser 405nm is no problem – what photoresist and how thick is the resist?
o Substrate type: Glass, silicon, laminate, film?
o Could we get some detailed description of the application ?
- Issue: Our systems have much higher resolution and capabilities :
o We can easily do a 2000 micron line, the specification isn’t clear as to the smallest line required.
o We offer difference resolutions for our systems including: 50, 25, 10, 8, 5, 3, 1 micron feature size capable systems.
- Issue: Budget
We are concerned based on the Bungard reference that NASA is not looking for high technology. Our systems range from $300k to $600k depending on configuration
This would be my response to this RFQ:
We have some basic questions:
Bungard: The Direct Imager in the RFQ is listed as a Bungard LaserPro 3000
- We assume we are to quote an equivalent or better.
- Bungard Website: https://www.bungard.de/index.php/de/produkte/fraesbohrplotter/uv-laserdirektbelichtung
- Issue: Their system is in no way comparable in technology level or pricing to our system.
o Specification : Your specification shows a line width of less than 2000 micrometers (.078 inches) which is very, very large for a system like ours, but not a problem.
Yes we specified the minimum line width achievable to be < 2000 um, however we prefer a system which can achieve lower resolution down to 50um if possible.
o Specification: Is there an accuracy requirement to the feature size?
The Line resolution down to 50 um is the main requirement, however a system with more accurate feature sizes would be great.
o Laser 405nm is no problem – what photoresist and how thick is the resist?
Positive Photoresist and of varying thickness in the tens of um range o Substrate type: Glass, silicon, laminate, film?
RF substrates https://urldefense.proofpoint.com/v2/url?u=https-3A__www.bungard.de_index.php_de_produkte_fraesbohrplotter_uv-2Dlaserdirektbelichtung&d=DwMFAg&c=ApwzowJNAKKw3xye91w7BE1XMRKi2LN9kiMk5Csz9Zk&r=FtqQ-382sfJnQfYz6UgHO0qZOVAqpvD9wbUFF5bfqeo&m=qpsL4VBcUYGJTV0Z6HADVrAtjBuYvz-XKcew2ZVC51Q&s=v0zGUR_oRIu-te6J2ZTFyXToAIzYiCThnk-Bd3U_qBI&e= https://urldefense.proofpoint.com/v2/url?u=https-3A__www.bungard.de_index.php_de_produkte_fraesbohrplotter_uv-2Dlaserdirektbelichtung&d=DwMFAg&c=ApwzowJNAKKw3xye91w7BE1XMRKi2LN9kiMk5Csz9Zk&r=FtqQ-382sfJnQfYz6UgHO0qZOVAqpvD9wbUFF5bfqeo&m=qpsL4VBcUYGJTV0Z6HADVrAtjBuYvz-XKcew2ZVC51Q&s=v0zGUR_oRIu-te6J2ZTFyXToAIzYiCThnk-Bd3U_qBI&e= https://urldefense.proofpoint.com/v2/url?u=https-3A__www.bungard.de_index.php_de_produkte_fraesbohrplotter_uv-2Dlaserdirektbelichtung&d=DwMFAg&c=ApwzowJNAKKw3xye91w7BE1XMRKi2LN9kiMk5Csz9Zk&r=FtqQ-382sfJnQfYz6UgHO0qZOVAqpvD9wbUFF5bfqeo&m=qpsL4VBcUYGJTV0Z6HADVrAtjBuYvz-XKcew2ZVC51Q&s=v0zGUR_oRIu-te6J2ZTFyXToAIzYiCThnk-Bd3U_qBI&e= https://urldefense.proofpoint.com/v2/url?u=https-3A__www.bungard.de_index.php_de_produkte_fraesbohrplotter_uv-2Dlaserdirektbelichtung&d=DwMFAg&c=ApwzowJNAKKw3xye91w7BE1XMRKi2LN9kiMk5Csz9Zk&r=FtqQ-382sfJnQfYz6UgHO0qZOVAqpvD9wbUFF5bfqeo&m=qpsL4VBcUYGJTV0Z6HADVrAtjBuYvz-XKcew2ZVC51Q&s=v0zGUR_oRIu-te6J2ZTFyXToAIzYiCThnk-Bd3U_qBI&e= o Could we get some detailed description of the application ?
Photolithography on RF circuit boards. This will be used for patterning of photoresist during the copper etching process. These are high frequency circuit boards and have small features sizes and require an advances LDI system to improve on etching accuracy.
- Issue: Our systems have much higher resolution and capabilities :
o We can easily do a 2000 micron line, the specification isn’t clear as to the smallest line required.
We would like to go down to 50 um o We offer difference resolutions for our systems including: 50, 25, 10, 8, 5, 3, 1 micron feature size capable systems.
The 50 um system would be what we are interested in.
- Issue: Budget o We are concerned based on the Bungard reference that NASA is not looking for high technology. Our systems range from $300k to $600k depending on configuration.
We are looking for the best technology that meets our present and future needs in this specific application.
We are looking for the most accurate system, but we do not need anything better than 50 um at the moment. Your 50 um resolution system meets this and other specifications.
The Bungard system also states it is capable of line resolution down to 50 um and hence the reason for its inclusion and reference.
Our target application is a low-cost solution for prototyping and we do not have the budget for a production quality system at this time.
A)
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