23-3B2 SOW Blue M Oven Redacted.pdf

STATEMENT OF WORK (SOW)

DMEA 23-3B2

19 January 2023

1.0 SCOPE:

1.1 TITLE: Blue M Oven IGF-6680-E-F4T

1.2 APPLICABILITY: For use in DMEA Foundry SiC device manufacturing to cure Polyimide film to passivate device.

1.3 BACKGROUND:

1.4 PURPOSE: Purchase of Blue M Oven IGF-6680-E-F4T Or Equal for polyimide cure capability for SiC device manufacturing and future high voltage device manufacturing.

2.0 REFERENCED GOVERNMENT PROVIDED RESOURCES:

2.1 GOVERNMENT DOCUMENTS:

Document No. Date Title eB 100714 ARMS Cleanroom Protocol

2.2 GOVERNMENT FURNISHED EQUIPMENT:

None.

2.3 GOVERNMENT FURNISHED FACILITIES/ACCESS:

Facility/Access Date DMEA 4234 54th Street, McClellan, CA 95652-2100 Upon Installation

3.0 REQUIREMENTS:

3.1 GENERAL REQUIREMENTS:

a. Include all items (e.g. hardware, software, and other documentation) as listed in the tool purchase package.

b. User Manuals (softcopy and/or hardcopy)

c. Correct or fix any hardware or software problems encountered during testing

d. Be operational and functional in accordance to tool vendor specifications

e. Provide DMEA with User Licenses and License Agreement

f. Provide DMEA with tool 1 year labor + 1 year parts warranty

g. Provide DMEA personnel with training (including but not limited to operational, routine maintenance, upkeep, and other pertinent functions) to effectively use the tool

3.2 PROGRAM MANAGEMENT: None

3.3 TASK REQUIREMENTS: DMEA is tasked with installation of tool but vendor will perform checks to guarantee tool is operational, according to vendor specs, and also provide tool training. Travel for Field Service Engineer to perform tool checks post installation and tool training is included in quote.

3.3.1 TOOL REQUIREMENT: The tool shall be capable of performing thermal cures on 150 mm or 200 mm semiconductor wafer substrates at various chamber temperatures, in a low O2 chamber environment, on various different types of thin polyimide films.

a. The tool shall be capable of achieving and maintaining process chamber temperatures of 35°C – 593°C.

b. The tool shall be capable of achieving and maintaining a minimum ramp rate of 1°C/min. and a maximum ramp rate of 6°C/min.

c. The tool shall be certified for use in a cleanroom environment for semiconductor manufacturing.

d. The tool shall be capable of achieving multiple temperature soaks and ramp ups within a temperature range of 150°C – 400°C, within the same cure program.

e. The tool shall be capable of achieving and maintaining a low O2 environment in the process chamber with concentrations of 100 ppm of O2 or less.

f. The tool shall be installable within a cleanroom bay area with a machine footprint no larger than 12.5 square feet and service space requirements should not exceed 24 inches from each side.

3.4 PROGRAM SUMMARY: None