Thermal Oxide (ID 1432, Thick 500 um, Diam 100 mm, Thermal Ox 300 nm, SSP, Res 1-10) and 1 more item

University Wafer has been awarded contract A207_PO-0474974 by the University of Virginia, with an award date of August 29, 2026. The cumulative contract value is $634.00. The contract specifies delivery to Inbo Sim and covers the procurement of specialized semiconductor materials consisting of two distinct product lines: thermal oxide wafers and silicon wafers, each ordered in quantities of ten units.

The first line item encompasses ten thermal oxide wafers (identification 1432) with specifications including 500 micrometer thickness, 100 millimeter diameter, 300 nanometer thermal oxide layer, single-side polished finish, and 1-10 ohm-centimeter resistivity, at a unit price of $40.90. The second line item comprises ten 100-millimeter silicon wafers (identification 783) with 500 micrometer thickness, p-type silicon composition, single-side polished finish, and 1-10 ohm-centimeter resistivity, at a unit price of $22.55 per unit. These materials are commonly utilized in semiconductor research, fabrication, and microelectronics applications within an academic or research environment.