Blanket Purchase Agreement HQ072723A0803

Award Date 6/7/23
Last Date to Order 6/7/26
Ultimate Awardee
Not listed
Federal Contract Vehicle
Pricing Type
Order Dependent (IDV only)
Legislative Mandate
Not listed
National Interest Action
None
Award Type
Multiple
Primary Consortia Member
Not listed
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  • HQ072723A0803
    Blanket Purchase Agreement
  • 9
    Federal Contract Awards

Printed Circuits Corporation has been awarded a blanket purchase agreement by the Defense Microelectronics Activity to provide printed circuit boards in support of microelectronics development efforts. Under the terms of the BPA, the contractor may receive multiple fixed-price call contracts valued collectively at $1.2M over a three-year ordering period ending June 2026.

To date, Printed Circuits Corporation has received four call contracts under this BPA. These calls require the contractor to design, fabricate, assemble, build, test, evaluate, verify and validate microelectronics printed circuit boards for the Defense Microelectronics Activity in accordance with unique specifications. Work will be performed at the contractor's Lilburn, Georgia facility. The calls range in value from $8,821.50 to $17,008.50 and have periods of performance from June 2023 to October 2023. All calls are set aside for small businesses and aim to support the Defense Microelectronics Activity's mission to develop trusted and radiation-hardened technologies for national security systems.

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