To organize conferences in december 2022 and 2023 and launch a community, aiming to increase female students' interest in the IT field through lectures by women studying computer science at…

Ended Project Grant Awarded Last action

Award ID
SJA80023GR0004
Recipient
Awarding agency
Obligated
$193,920

Award facts

Assistance listing
19.040 Public Diplomacy Programs
Completion date
Funding
  • $79,640.00 Federal
  • $114,280.00 Non-federal
Funding agency
Bureau of East Asian and Pacific Affairs Department of State
Place of performance
Japan

Award details come from USAspending.gov.

About this award

The Department of State Bureau of East Asian and Pacific Affairs awarded General Inc. Association Waffle $193,920 under the Public Diplomacy Programs federal grant program (CFDA 19.040) to organize conferences in December 2022 and 2023, and launch a community aiming to increase female students' interest in the information technology field through lectures by women studying computer science at universities and female engineers in Japan. The award period is from November 1, 2022 to June 30, 2024. The funding will support conferences and community engagement activities delivered by General Inc. Association Waffle to expose more young women in Japan to career opportunities in computer science and engineering through role models and information about educational pathways.

Description

To organize conferences in december 2022 and 2023 and launch a community, aiming to increase female students' interest in the IT field through lectures by women studying computer science at universities and female engineers.

Quick answers

Who received award SJA80023GR0004?

SJA80023GR0004 was awarded to General Inc. Association Waffle by US Embassy Tokyo (US Consulates and Embassies) on November 1, 2022.

How much is award SJA80023GR0004 worth?

$193,920 has been obligated on SJA80023GR0004: $79,640 in federal funding and $114,280 in non-federal funding.

Which agency awarded SJA80023GR0004?

US Embassy Tokyo (US Consulates and Embassies) awarded SJA80023GR0004, with funding from Bureau of East Asian and Pacific Affairs (Department of State).

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