I-corps: translation potential of a direct-to-chip (D2C) cold plate for electronic cooling and data centers

Active Project Grant Awarded Last action

Award ID
2627843
Recipient
Awarding agency
Obligated
$50,000

Award facts

Assistance listing
47.084 NSF Technology, Innovation, and Partnerships
Completion date 24% complete
Place of performance
Villanova, PA 19085, USA

Award details come from USAspending.gov.

Description

As the agency reported it.

Abstract
This i-corps project is based on the development of a direct-to-chip cold plate for electronic cooling in data centers. Currently, hyperscale data centers and high-performance computing systems use traditional air and liquid cooling methods that are increasingly inadequate for handling the heat generated by advanced artificial intelligence (AI) and high-performance computing (HPC) chips. The cold plate technology is designed to enable higher computational power density while minimizing energy consumption. In addition, this approach is designed to improve two-phase cooling solutions, which are emerging as the preferred approach for next-generation data centers, offering energy savings, reduced operational costs, and improved reliability. The technology provides a practical upgrade path for operators, allowing enhanced performance without requiring a complete overhaul of existing infrastructure, and aims to deliver significant value in the coming decade. This i-corps project utilizes experiential learning coupled with first-hand investigation of the industry ecosystem to assess the translation potential of a biomimetic designed cold plate for thermal management. The technology is designed to reduce the heat generated by advanced artificial intelligence (AI) and high-performance computing (HPC) chips utilizing two-phase heat transfer technology with scalable, deployable products for data centers and related applications. Advanced microfluidic architectures and surface structures are integrated so that they provide efficient heat transfer effectiveness, reduce hotspot temperatures, and lower pumping power requirements. Lab-scale results demonstrate a heat transfer coefficient enhancement of up to five times compared to conventional solutions. The technology may accelerate the commercialization of energy-efficient cooling technologies and support the growth of AI and HPC systems while improving U.S. Economic competitiveness. This award reflects NSF's statutory mission and has been deemed worthy of support through evaluation using the foundation's intellectual merit and broader impacts review criteria.- subawards are not planned for this award.

Quick answers

Who received award 2627843?

2627843 was awarded to Villanova University In The State Of Pennsylvania by National Science Foundation on August 1, 2026.

How much is award 2627843 worth?

$50,000 has been obligated on 2627843.

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