Project Grant 2510283
- The National Science Foundation Division of Electrical, Communications and Cyber Systems awarded Trustees of Dartmouth College $485,757 on October 15, 2026, under the Engineering program (CFDA 47.041) to develop a high-throughput semiconductor device platform accelerating material-process-device co-design through automated experimentation, machine learning, and electrostatic modeling. The project combines automated experiments with physics-informed machine learning to efficiently explore large...
- This $275,000 National Science Foundation (NSF) Project Grant, awarded under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program, funds the development and validation of materials and processes for advanced semiconductor manufacturing at Geminatio, a for-profit organization. The goal is to enable the progression of Moore's Law and strengthen domestic semiconductor manufacturing capacity and capability, which has been impacted by recent supply chain issues. The project seeks to...
- The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded Texas Tech University $534,821 on July 1, 2026, under the Engineering program (CFDA 47.041) to support research manipulating the interfacial structures of additively manufactured semiconductor chalcogenides. The award funds a CAREER (Faculty Early Career Development Program) grant focused on advancing additive manufacturing of chalcogenide-based semiconductors by establishing fundamental...
- The National Science Foundation Division of Electrical, Communications and Cyber Systems awarded Trustees of Dartmouth College $450,000 on October 15, 2026, under the Engineering program (CFDA 47.041) to advance metal halide perovskite materials for electronic and photonic devices including photodetectors, imaging systems, radiation sensors, solar cells, displays, and flexible electronics. The project examines how the physical properties of perovskite inks—viscosity, wetting, and drying...
- The University of Texas at Dallas received a $570,000 Project Grant from the National Science Foundation (NSF) Division of Electrical, Communications and Cyber Systems under the Engineering program (CFDA 47.041), awarded October 1, 2025, with completion targeted for September 30, 2028. This research project develops two-dimensional (2D) oxyhalide semiconductors engineered for back-end-of-the-line (BEOL) processing compatibility, addressing critical energy consumption challenges in...
- This Project Grant from the National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation supports research to advance manufacturing processes for semiconductor electronic and quantum devices at the atomic scale. Funded for $292,392 over two years from January 1, 2023 through December 31, 2024, the award supports the University of Maryland, College Park under the NSF Engineering program (CFDA 47.041). The research aims to develop robust manufacturing techniques with...
- This National Science Foundation (NSF) Engineering program (CFDA 47.041) Project Grant award of $521,832 supports research to develop an "all-on-a-chip" nanomanufacturing system capable of additively printing three-dimensional features at the deep-nanometer scale. The research aims to leverage advancements in electrified droplet ejection and nanofluidics to enable the use of yoctoliter-to-zeptoliter scale droplets for high-resolution, integrated circuit-compatible additive...
- This $410,000 National Science Foundation project grant supports research at Dartmouth College from September 2022 through August 2025 to develop a new paradigm of two-dimensional metal oxide transistors enhanced through quantum modulation doping. The researchers will develop a fundamental understanding of how heterointerfaces can be engineered to enhance electronic transport in channels consisting of heterostructures of 2-3 nm thick two-dimensional wide bandgap oxide semiconductors. This work...
- The National Science Foundation (NSF) awarded Arizona State University a $500,000 Project Grant under the STEM Education program (CFDA 47.076) to revolutionize graduate education in semiconductor manufacturing. The 3-year grant will develop a virtual semiconductor manufacturing line and provide hands-on training for students, aiming to address the complexity of concepts in this field and the challenges of doubling the existing semiconductor workforce in response to the CHIPS and Science Act. Key...
- The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded the University of Connecticut $549,994 on September 1, 2026, to develop a light-based additive manufacturing platform for integrated circuits. The research, titled "3D ONE-STEP HETEROGENEOUS MANUFACTURING FOR INTEGRATED CIRCUITS (3D OHMIC)," integrates digital light processing with stereolithography and femtosecond-laser-based photoreduction to enable one-step fabrication of...
The National Science Foundation Division of Civil, Mechanical, and Manufacturing Innovation awarded Trustees of Dartmouth College $429,534 on August 1, 2026, under the Engineering program (CFDA 47.041) to develop sustainable, wafer-scale manufacturing of ultra-thin semiconductor materials using molten interfaces. The project establishes scientific foundations for a scalable manufacturing process that produces ultra-thin semiconductor layers with thicknesses in the one to few nanometer range through controlled oxidation and chalcogenization reactions at a dynamic liquid metal meniscus. The work addresses existing manufacturing constraints—high temperatures, expensive infrastructure, and complex processing steps—by advancing a low-temperature, energy-efficient approach that enables highly uniform semiconductor layers over large areas with exceptional thickness control. Research objectives include understanding how meniscus shape, motion, and stability govern film formation, including the roles of contact line dynamics, surface tension, and gravitational effects. The project supports national priorities in strengthening domestic semiconductor manufacturing, advancing energy-efficient technologies, and expanding capabilities for large-area and flexible electronic systems. Education and workforce development activities train students in advanced manufacturing and materials engineering. Work is performed in Hanover, New Hampshire, with a period of performance from August 1, 2026, through July 31, 2029.
Mod # | Description | ReasonForModification | Federal Obligation | Date |
|---|---|---|---|---|
| Not listed | $429.5k | 8/5/26 |