This $2,000,000 project grant awarded by the National Science Foundation (NSF) Computer and Information Science and Engineering (CISE) program (CFDA 47.070) aims to revolutionize the design of next-generation data centers through novel chiplet and 2.5D integration practices. The project, titled "CHIPLETS360: Datacenter Optimization Through Whole-Stack Novel Accounting, Design, Reuse, and Heterogeneous Provisioning of Chiplets," will apply economic concepts to the cost and lifetime concerns of data center systems. The goal is to develop approaches that advance capabilities in newly deployed compute servers by leveraging novel chiplet-based designs to provide higher performance and energy efficiency, while also addressing critical system-level factors such as thermal, power delivery, and signal integrity. The results will lead to advances in heterogeneous systems ideal for agile virtual hardware design and heterogeneous integration, allowing for the collection of data center resources to build virtual or disaggregated resources that can seamlessly match compute workloads to various technologies and heterogeneous chiplets. The project will take a full-stack approach by modeling costs and integrating critical components previously ignored in design and simulation tools, such as power electronics and asynchronous circuits, to promote hardware agility, efficiency, and adaptability to new compute algorithms while simultaneously reducing costs and extending equipment lifetimes.
Mod # | Description | Reason For Modification | Federal Obligation (Click to sort descending) | Date (Click to sort ascending) |
|---|---|---|---|---|
| Not listed | $2.0m | 6/11/25 |