This $800,000 Project Grant awarded by the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) program (CFDA 47.070) aims to pioneer a computing system for massive AI workloads. The project will develop new architectural and design automation tools for a reconfigurable-on-package system using "tiny chiplets" - miniaturized composable computing components. This innovative approach seeks to address the challenges related to chiplet definition, interconnection, power/thermal integrity, and workload mapping as current monolithic chips reach technological limits. The project also plans to improve the knowledge base through curriculum development, undergraduate research experiences, and K-12 outreach programs to address semiconductor workforce shortages. The award period runs from July 1, 2024 to June 30, 2028, and the work will be performed by the Regents of the University of Minnesota.
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