This $300,000 federal Project Grant was awarded by the National Science Foundation's (NSF) Engineering program (CFDA 47.041) to Carnegie Mellon University (CMU). The grant aims to experimentally demonstrate wafer-scale 2D transistors in the "silicon-impossible" territory (sub-5-nm channel length) and investigate their fundamental limits through a combination of experimental and theoretical efforts. Key objectives include: (1) developing a high-throughput, scalable technique for...
This $455,489 Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) supports the development of monolithic three-dimensional (3D) integrated circuit technology based on high-performance junctionless transistors built on single-crystalline silicon nanomembranes. The research aims to enable higher device integration density and improved communication bandwidth with lower energy consumption between circuit blocks, helping to sustain U.S. semiconductor...
This Project Grant award of $130,134 from the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) program supports research to quantify the trade-offs in power, performance, area, and total carbon footprint of monolithic three-dimensional integrated circuits (3D ICs) for carbon-efficient computing. The key objectives are to: 1) model the embodied carbon footprint of monolithic 3D ICs with emerging beyond-silicon nanotechnologies, 2) analyze carbon...
This Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) provides $332,817 to the University of California, Santa Barbara (UCSB) to conduct research on novel gate-stack engineering for 2D materials-based field-effect transistors (FETs). The project aims to develop a comprehensive simulation framework and fabricate test structures to address the design, fabrication, reliability, and performance challenges of 2D semiconductor FETs. This research seeks to...
The National Science Foundation Division of Electrical, Communications and Cyber Systems awarded The Leland Stanford Junior University a $375,000 Project Grant under the Engineering (47.041) federal grant program. The grant will support the development of computational tools for photonic design from August 1, 2021 to July 31, 2024. Specifically, Stanford University will leverage physics-driven approaches to create new computational methods and software tools that enable the design of...
The National Science Foundation Division of Electrical, Communications and Cyber Systems awarded $400,000 under the Engineering (47.041) federal grant program to The Leland Stanford Junior University, also known as Stanford University, for a project grant titled "Scalable Diamond Quantum Systems." Over a three-year period from May 1, 2022 to April 30, 2025, Stanford University will develop optically accessible spin qubit systems using tin-vacancy color centers in diamond photonic...
This $430,234 National Science Foundation project grant supports the development of testing and design-for-test techniques for monolithic 3D integrated circuits at Arizona State University. Funded under the Computer and Information Science and Engineering program (CFDA 47.070), the award will advance research on built-in self-test solutions, test generation methods, and power distribution designs to enable reliable testing and defect isolation in multitiered 3D chip architectures. Outcomes...
This five-year Project Grant from the National Science Foundation's Division of Materials Research, totaling $239,749, supports theoretical and computational research as well as educational efforts related to emerging layered materials. Specifically, the awardee, Stanford University, will utilize large-scale simulations and develop new methods to study the electronic and optical properties of vertically stacked two-dimensional materials with moiré patterns. This includes calculating effective...
The National Science Foundation (NSF) awarded a $414,655 Project Grant under the Engineering program (CFDA 47.041) to Purdue University. The project aims to address emerging challenges in the field of materials and computing, specifically focusing on heterogeneous integration (HI) in packaging (HIP). The key objectives are to develop rapid 3D metrology techniques and incorporate machine learning to accelerate the detection of fabrication defects, thereby advancing the development of...
This National Science Foundation (NSF) Engineering program (CFDA 47.041) Project Grant award provides $250,000 to the University of Florida for a 3-year period from October 1, 2024 to September 30, 2027. The award aims to experimentally demonstrate wafer-scale 2D transistors with physical channel lengths below 5 nm, investigating the fundamental limits of these transistors to advance computational technologies beyond the "silicon-impossible" territory. The key activities include: (1)...