Purdue University was awarded a $332,957 project grant from the National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems to support research into thermal transport in two-dimensional semiconductor materials. With a completion date of July 31, 2024, this award funds work under the NSF Engineering program (CFDA 47.041), which aims to improve engineering research and education. Specifically, the grant will allow Purdue researchers to study heat...
This $344,743 federal Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) will support the development of advanced computational methods to simulate lattice vibrations and heat transfer in complex materials beyond the standard quasiparticle approximation. The research aims to provide more reliable predictions of thermal properties, especially in technologically important materials like thermoelectrics and thermal barrier coatings. The project will...
This National Science Foundation (NSF) Engineering program (CFDA 47.041) Project Grant award, totaling $560,000, will support research at the University of California, Berkeley (UC Berkeley) to develop new methods for investigating nanoscale thermal transport phenomena. The research will combine ultrafast optical measurement techniques with nanoscale spatial resolution to probe energy carriers, such as electrons and phonons, in both equilibrium and non-equilibrium regimes. The goal is to...
This three-year Project Grant from the National Science Foundation's $350,928 Engineering program (CFDA 47.041) will fund research at Purdue University on extraordinary radiative transfer through hyperbolic materials and interfaces. The grant aims to advance fundamental understanding of enhanced radiative heat transfer inside newly discovered hyperbolic materials and across material interfaces and devices. Researchers will investigate the spectral, temperature-dependent and spatial properties of...
This National Science Foundation (NSF) Engineering program (CFDA 47.041) Project Grant award to Auburn University for $269,528 will investigate how the twist angle affects the thermal conductance of 2D material homo- and heterojunctions. The goal is to provide the first experimental data on this phenomenon, which has only been explored through modeling and theoretical analysis. The project will use new Raman techniques to measure temperature differences and heat flux across these junctions,...
Through a $300,000 Project Grant from the National Science Foundation (NSF) Office of Advanced Cyberinfrastructure, Purdue University is enhancing the FOURPHONON open-source computational package to enable accurate and affordable prediction of thermal conductivity in materials. This award under the NSF's Computer and Information Science and Engineering (CISE) program supports the development of advanced computational methods and machine learning models to accelerate the calculation of...
This $234,696 National Science Foundation Project Grant, funded through the Engineering program (CFDA 47.041), will support research into cross-plane heat conduction in two-dimensional materials under large compressive strain. Over a two-year period from June 2022 to May 2025, researchers at the University of Nevada, Reno will conduct experimental and computational studies of heat transfer across layers in three material systems - pristine MoS2, twisted MoS2, and graphite - under high...
This Project Grant award from the National Science Foundation (NSF) Engineering program (CFDA 47.041) provides $199,984 to Kennesaw State University Research And Service Foundation, Inc. (KSU R&SF) to study the impact of mechanical strain on the thermal transport characteristics of various 3D carbon nanostructures, such as pillared graphene structures, 3D graphene foam, and carbon nanotube network films. The goal is to enhance understanding of how mechanical deformation affects the heat...
This Project Grant award, funded by the U.S. National Science Foundation (NSF) under the Engineering program (CFDA 47.041), supports a collaborative research project between Duke University and ETH Zürich to explore the thermal implications of scaling and structure of metal contacts to two-dimensional (2D) semiconductor materials. The $400,000 award, effective September 1, 2024 through August 31, 2027, aims to: 1) develop an apparatus for nanoscale thermal mapping of 2D contact structures; 2)...
This $330,000 project grant from the National Science Foundation's Division of Electrical, Communications and Cyber Systems and Engineering program (CFDA 47.041) supports collaborative research between Purdue University and the University of St. Thomas focused on investigating two-dimensional (2D) materials and developing photoswitchable interlayer exciton devices. Key activities include constructing 2D heterostructured hybrid devices from transition metal dichalcogenides and photochromic...