Thermal transport in two-dimensional semiconductor materials
Ended Project Grant Awarded Last action
- Award ID
- 2051525
- Recipient
-
Purdue University UEI YRXVL4JYCEF5
- Awarding agency
-
Division of Chemical, Bioengineering, Environmental, and Transport System
National Science Foundation
- Obligated
- $332,957
Award facts
- Assistance listing
- 47.041 Engineering
- Completion date
- Place of performance
- West Lafayette, IN 47907, USA
Award details come from USAspending.gov.
About this award
Purdue University was awarded a $332,957 project grant from the National Science Foundation Division of Chemical, Bioengineering, Environmental, and Transport Systems to support research into thermal transport in two-dimensional semiconductor materials. With a completion date of July 31, 2024, this award funds work under the NSF Engineering program (CFDA 47.041), which aims to improve engineering research and education. Specifically, the grant will allow Purdue researchers to study heat conduction at the nanoscale using new 2D materials, advancing fundamental understanding with potential applications in electronics and energy technologies. The place of performance is Purdue University in West Lafayette, Indiana.
Quick answers
Who received award 2051525?
2051525 was awarded to Purdue University by Division of Chemical, Bioengineering, Environmental, and Transport System (National Science Foundation) on August 1, 2021.
How much is award 2051525 worth?
$332,957 has been obligated on 2051525.
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