Project Grant 2125826

Award Date 11/1/21
Completion Date 10/31/24
Dollars Obligated $300K
Federal Grant Program
47.041
Assistance Type
Project Grant
Place of Performance
West Lafayette, IN 47907, USA
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This Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) provides $376,318 to Purdue University to address emerging challenges in heterogeneous integration and packaging in the semiconductor industry. The project aims to develop rapid 3D metrology techniques and incorporate machine learning to accelerate the detection of fabrication defects in semiconductor packages, thereby improving the reliability and performance of electronic packaging. The project...
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