New award - virginia polytechnic institute and state university control number: 3499-1536 project title: ''dual-use converter-in-fluid integrated vertical-stack kilo-ampere SIC submodule valve for…

The Department of Energy Advanced Research Projects Agency awarded Virginia Polytechnic Institute & State University a $2.95 million cooperative agreement on July 30, 2026, under the Advanced Research Projects Agency - Energy program (CFDA 81.135) to develop a dual-use converter-in-fluid integrated vertical-stack kilo-ampere SiC submodule valve for next-generation high-density HVDC converter stations.

The project delivers a novel medium-voltage silicon carbide power electronics submodule designed to replace conventional HVDC converter technology with a more compact and efficient solution. Key innovations include high-density SiC power modules that reduce power loss by a factor of 10 compared to existing technology; dual-use converter technology that submerges power modules in dielectric cooling fluid, eliminating bulky air-insulated valve halls and reducing space requirements by over 10 times; and advanced packaging and bonding techniques using innovative sintering and PCB embedded designs to improve durability and achieve higher power densities.

Performance occurs in Blacksburg, Virginia, with a period of performance extending from July 30, 2026, through July 29, 2029. Virginia Tech executes the work as the prime recipient with full internal delivery capability and established research infrastructure spanning multiple campuses.

New award - virginia polytechnic institute and state university control number: 3499-1536 project title: ''dual-use converter-in-fluid integrated vertical-stack kilo-ampere SIC submodule valve for next generation high-density hvdc converter station'' high-voltage direct current (hvdc) power transmission is crucial for delivering electricity efficiently over long distances. However, current hvdc converter stations are large, expensive, and inefficient. This project proposes a revolutionary approach to significantly reduce the size and cost of these stations while improving their efficiency. Our team will develop a novel medium- voltage (MV) silicon carbide (SIC)-based submodule valve, designed to replace conventional hvdc power electronics with a more compact and efficient solution. The key innovations include: high-density SIC power modules these advanced modules will enable a 10 reduction in power loss compared to existing technology, improving energy efficiency. Dual-use converter in dielectric fluid technology instead of bulky air-insulated valve halls, our approach submerges power modules in a dielectric cooling fluid, eliminating the need for large cooling and insulation systems, reducing space requirements by over 10. Advanced packaging and bonding techniques we will use innovative sintering and PCB embedded designs to improve durability and achieve higher power densities.