Federal Cooperative Agreement Summary

The National Institute of Standards and Technology (NIST) awarded a Cooperative Agreement totaling $126,313.42 to Theiss Research under the Measurement and Engineering Research and Standards program (CFDA 11.609) for the project "Operando Spectroscopic Investigation of Electrodeposition Processes for Interconnect Materials." The award, dated April 1, 2026, with a completion date of March 31, 2029, supports research aimed at advancing semiconductor manufacturing metrology aligned with U.S. CHIPS Act objectives. Theiss Research, a nonprofit research organization based in La Jolla, California, will deliver comprehensive scientific research and technical expertise focused on understanding electrodeposition mechanisms critical to advanced semiconductor interconnect technologies.

The primary deliverables involve developing advanced spectroscopic methodologies and measurement techniques for characterizing metal electrodeposition processes used in chip manufacturing. The research employs shell-isolated nanoparticle-enhanced Raman spectroscopy (SHINERS) as the central investigative tool to provide high-sensitivity, non-invasive analysis of interfacial chemistry and metal growth dynamics under realistic electrochemical conditions. Supporting analyses utilizing X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM) will complement the core spectroscopic investigations. The project will generate new scientific knowledge and contribute to training technical talent for the U.S. semiconductor industry by advancing understanding of additive-assisted electrodeposition and nanoscale feature-filling processes essential for next-generation interconnect technologies.