Create dataset focused on the properties of thermosetting polymers, a cost-effective insultation solutions for semiconductor packaging

Ended Cooperative Agreement Awarded Last action

Award ID
70NANB24H291
Recipient
Awarding agency
Obligated
$310,000

Award facts

Completion date
Place of performance
College Park, MD 20742, USA

Award details come from USAspending.gov.

Description

As the agency reported it.

Purpose
The purpose of this project is to create dataset focused on the properties of thermosetting polymers, a cost-effective insultation solutions for semiconductor packaging.
Activities
The researchers will: 1) measure the effective cure shrinkage using a fiber bragg grating sensor; 2) measure the viscoelastic bulk modulus under hydrostatic loading; and 3. To develop a 3-d numerical modeling scheme to predict the warpage of complex packaging architectures using the properties obtained from activities 1 and 2.
Expected outcomes
The datasets should improve the ability to design and predict accurate warpage in semiconductor packaging materials based on polymers.
Intended beneficiaries
The model generated from this research can be used by researchers working to design for and predict accurate warpage in semiconductor packaging materials based on polymers.

Transactions

Action Obligated Date
Amendment $150,000
Original award $160,000

Quick answers

Who received award 70NANB24H291?

70NANB24H291 was awarded to University Of Maryland, College Park by National Institute of Standards and Technology (Department of Commerce) on September 15, 2024.

How much is award 70NANB24H291 worth?

$310,000 has been obligated on 70NANB24H291.

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