Use brillouin light scattering coupled with other techniques, such as low frequency raman, to build a new microscope to model and optimize the performance of advanced packaging materials with…
Active Cooperative Agreement Awarded Last action
- Award ID
- 70NANB24H111
- Recipient
-
Theiss Research UEI F67SDLWMJH17
- Awarding agency
-
National Institute of Standards and Technology
Department of Commerce
- Obligated
- $338,746
Award facts
- Assistance listing
- 11.609 Measurement and Engineering Research and Standards
- Completion date 72% complete
- Place of performance
- La Jolla, CA 92037, USA
Award details come from USAspending.gov.
Description
- Purpose
- The purpose of this project is to use brillouin light scattering coupled with other techniques, such as low frequency raman, to build a new microscope to model and optimize the performance of advanced packaging materials with respect to warpage and thermal operation range, characteristics underlying device performance, and longevity.
- Activities
- The researcher will apply brillouin light scattering (BLS) and low frequency raman (LFR) imaging microscopy techniques to investigate mechanical properties in epoxy compounds used in semiconductor packaging and correlate the local properties to the processing conditions. The researcher will perform BLS / LFR measurements on composite samples prepared under various conditions using the microscope capabilities at NIST, and the researcher will collect BLS / LFR images and possibly other mechanical data of the investigated composites.
- Expected outcomes
- If successful, the researcher would demonstrate for the first time, an entirely new capability to use brillouin light scattering measurements to tie local material properties to large scale performance in advanced packaging materials. This could translate to an innovative new way for the semiconductor industry to evaluate new packaging solutions, or even perform in-line inspections, with the proper modeling. This work has the potential to drive the metrology for this industry in an entirely new direction with rapid, nondestructive measurements.
- Intended beneficiaries
- NIST researchers and microelectronic entities involved in the design of advanced packaging semiconductors will benefit from improved quantitative measurement methods, open-source materials data, model calibration frameworks, and predictive modeling tools.
- Subrecipient activities
- The recipient does not intend to subaward funds.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Amendment | $189,801 | |
| Original award | $148,945 |
Quick answers
Who received award 70NANB24H111?
70NANB24H111 was awarded to Theiss Research by National Institute of Standards and Technology (Department of Commerce) on September 1, 2024.
How much is award 70NANB24H111 worth?
$338,746 has been obligated on 70NANB24H111.
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