Develop silicon chip-integrated photonic devices operating at telecommunications wavelengths for basic quantum science research and applications in quantum information technologies, such as quantum…
Active Cooperative Agreement Awarded Last action
- Award ID
- 70NANB24H057
- Recipient
-
Theiss Research UEI F67SDLWMJH17
- Awarding agency
-
National Institute of Standards and Technology
Department of Commerce
- Obligated
- $454,005
Award facts
- Assistance listing
- 11.609 Measurement and Engineering Research and Standards
- Completion date 83% complete
- Place of performance
- La Jolla, CA 92037, USA
Award details come from USAspending.gov.
Description
- Purpose
- The purpose of this grant is to develop silicon chip-integrated photonic devices operating at telecommunications wavelengths for basic quantum science research and applications in quantum information technologies, such as quantum computing and quantum networks.
- Activities
- The project will involve the design, fabrication and testing of chip-based integrated photonic devices for the generation of quantum light based on material defects purposely induced in silicon chips. Measurement capabilities will be developed to support the optimization of quantum light emission by induced defects, in terms of efficiency and other critical properties for quantum information research and applications. Chip-integrated photonic components will be designed to allow the on-chip emitted quantum light to be maximally leveraged in quantum information applications - for instance, efficiently directing the on-chip emitted light towards signal processing systems on- or off-chip. Nanofabrication processes will be developed and optimized to implement the designed devices. Fabricated devices will be characterized for their optical performance, and measured results will provide feedback for further optimization. Finally, optimized devices will be produced to support research and development in photonic quantum information basic research and applications.
- Expected outcomes
- The project will lead to the development of optimized, high-yield nanofabrication processes for a class of silicon chip-scale integrated optical devices at telecom wavelengths that can be used in both basic research and applications in quantum information technologies. Finalized devices will be available for experimental quantum research and photonic quantum technology development.
- Intended beneficiaries
- Both fabrication processes and devices produced by this research will benefit scientists working in quantum science and technology investigations. This research will also benefit researchers doing work on on-chip integrated silicon photonic circuits, nanophotonics, and silicon-based quantum computation.
- Subrecipient activities
- The recipient does not intend to subaward funds.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Amendment | $142,905 | |
| Amendment | $165,000 | |
| Original award | $146,100 |
Quick answers
Who received award 70NANB24H057?
70NANB24H057 was awarded to Theiss Research by National Institute of Standards and Technology (Department of Commerce) on May 1, 2024.
How much is award 70NANB24H057 worth?
$454,005 has been obligated on 70NANB24H057.
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