Cooperative Agreement 2427409
Award Date
7/15/25
Completion Date
6/30/30
Dollars Obligated
$600K
Federal Agency
Division of Computing and Communication Foundations
Federal Grant Program
47.070
Assistance Type
Cooperative Agreement
Place of Performance
Chicago, IL 60637, USA
Similar Awards
The National Science Foundation (NSF) awarded a $1,400,000 Cooperative Agreement under the Computer and Information Science and Engineering (CISE) Federal Grant Program (CFDA 47.070) to Purdue University. The project, titled "CHIP DESIGN HUB: OPEN, ACCESSIBLE AND SCALABLE INFRASTRUCTURE FOR RESEARCH AND EDUCATION", aims to establish a national chip design hub to provide education, training, and infrastructure to universities and colleges across the U.S. The goal is to increase the...
This $1,000,000 Cooperative Agreement award from the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships (CFDA 47.084) program aims to develop a self-paced, online curriculum that provides non-STEM professionals with training to enter the chip design industry. The "BASICS" program is a partnership between New York University's (NYU) Bridge Program, Computer Engineering Department, and the "Zero-to-ASICs" online curriculum. The program will...
This $430,234 National Science Foundation project grant supports the development of testing and design-for-test techniques for monolithic 3D integrated circuits at Arizona State University. Funded under the Computer and Information Science and Engineering program (CFDA 47.070), the award will advance research on built-in self-test solutions, test generation methods, and power distribution designs to enable reliable testing and defect isolation in multitiered 3D chip architectures. Outcomes...
This $300,000 EAGER grant awarded by the National Science Foundation (NSF) under the Technology, Innovation, and Partnerships (CFDA 47.084) program supports the "CHIPS in Space" alliance led by the Texas A&M University System. The goal of this one-year project is to advance semiconductor manufacturing capabilities by leveraging the unique conditions of the microgravity environment in space. The alliance aims to develop pioneering scientific and technological breakthroughs in...
This $455,489 Project Grant award from the National Science Foundation's Engineering program (CFDA 47.041) supports the development of monolithic three-dimensional (3D) integrated circuit technology based on high-performance junctionless transistors built on single-crystalline silicon nanomembranes. The research aims to enable higher device integration density and improved communication bandwidth with lower energy consumption between circuit blocks, helping to sustain U.S. semiconductor...
This Cooperative Agreement award, funded by the National Science Foundation (NSF) through its STEM Education program (CFDA 47.076), aims to develop and deploy a hands-on semiconductor manufacturing training program at the University of Utah. The $999,420 award, which runs from July 2024 to June 2027, seeks to train a diverse domestic workforce to meet the current and future technological needs of the semiconductor industry, as outlined in the CHIPS Act. The program will provide participants with...
This Project Grant award of $38,679, provided by the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) program (CFDA 47.070), will support the development of a process-aware, reliable, and efficient electronic design automation (EDA) framework for monolithic three-dimensional integrated circuits (M3D ICs) at North Dakota State University (NDSU). The key objectives of this 5-year project are to: (a) develop shielding mechanisms to mitigate the impact of...
This $732,964 Cooperative Agreement award from the National Science Foundation (CFDA 47.084 - NSF Technology, Innovation, and Partnerships) is for the PIVOTS: CHICAGOLAND PARTNERSHIP FOR SEMICONDUCTOR AND MICROELECTRONICS EXPERIENTIAL LEARNING project. The project aims to prepare individuals from underrepresented minority groups with the skills necessary to start new careers in the semiconductor and microelectronics industry in the Chicagoland area through a series of compensated experiential...
This $800,000 Project Grant awarded by the National Science Foundation's (NSF) Computer and Information Science and Engineering (CISE) program (CFDA 47.070) aims to pioneer a computing system for massive AI workloads. The project will develop new architectural and design automation tools for a reconfigurable-on-package system using "tiny chiplets" - miniaturized composable computing components. This innovative approach seeks to address the challenges related to chiplet definition,...
The University of Chicago received a $166,302 project grant from the National Science Foundation Office of Advanced Cyberinfrastructure under the Computer and Information Science and Engineering program (CFDA 47.070). The grant supports collaborative research to enable extremely fine-grained parallelism on modern many-core architectures. The research is expected to advance the development and use of cyberinfrastructure to accelerate discovery and innovation in computing, communications, and...