This $276,780 Project Grant awarded by the National Science Foundation (NSF) Integrative Activities (IA) program will fund the development of a process-aware, reliable, and efficient electronic design automation (EDA) framework for monolithic three-dimensional integrated circuit (M3D IC) designs at North Dakota State University (NDSU).
The key objectives of the project are to: (a) mitigate the performance impact of metal inter-layer vias in bulk-substrate M3D IC processes, (b) optimize the use of back-end-of-line transistors in ultra-thin selective-substrate M3D IC processes, and (c) enable efficient M3D IC designs for heterogeneous integration across both bulk-substrate and ultra-thin selective-substrate processes. The project also incorporates educational activities, such as developing hands-on learning tools and IC tape-out experiences, to train students from high school to graduate levels on M3D IC design challenges and the need for energy-efficient ICs. The award, effective from February 15, 2025 to January 31, 2030, aims to advance the EDA methodology and facilitate further progress in M3D IC technology.
Generated 3/4/25, 4:14 AM