The National Science Foundation (NSF) has awarded a $732,897 Cooperative Agreement to the University of California, Berkeley (UC Berkeley) under the NSF Technology, Innovation, and Partnerships (CFDA 47.084) program. The project, titled "Workforce Innovation and Inclusion in Semiconductors and Emerging Research Areas (WIISER)", aims to engage undergraduate students from diverse backgrounds in industry internships and experiential learning opportunities in the semiconductor and emerging...
This Cooperative Agreement award from the National Science Foundation's STEM Education program (CFDA 47.076) provides $999,997 to Rochester Institute of Technology (RIT) to develop an experiential learning-based workforce development model for the U.S. semiconductor industry. RIT will collaborate with Monroe Community College and Finger Lakes Community College, as well as industry partners GlobalFoundries and Micron Technology, to provide a pipeline for community college students to earn...
This Cooperative Agreement award, funded by the National Science Foundation (NSF) through its STEM Education program (CFDA 47.076), aims to develop and deploy a hands-on semiconductor manufacturing training program at the University of Utah. The $999,420 award, which runs from July 2024 to June 2027, seeks to train a diverse domestic workforce to meet the current and future technological needs of the semiconductor industry, as outlined in the CHIPS Act. The program will provide participants with...
This $732,964 Cooperative Agreement award from the National Science Foundation (CFDA 47.084 - NSF Technology, Innovation, and Partnerships) is for the PIVOTS: CHICAGOLAND PARTNERSHIP FOR SEMICONDUCTOR AND MICROELECTRONICS EXPERIENTIAL LEARNING project. The project aims to prepare individuals from underrepresented minority groups with the skills necessary to start new careers in the semiconductor and microelectronics industry in the Chicagoland area through a series of compensated experiential...
This Cooperative Agreement award of $1,000,000 from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) aims to expand and diversify the semiconductor workforce by recruiting current college students, primarily first-year students, into engineering programs and career pathways within the semiconductor industry. The project, led by Boise State University, will transform degree pathways through a partnership with the College of Southern...
This federal Cooperative Agreement award of $1,000,000 from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) aims to provide experiential learning and co-curricular activities that increase interest in and access to career pathways in emerging technology fields, particularly in information technology and advanced manufacturing, for individuals from diverse professional and educational backgrounds. The project, led by Grand Rapids...
This Project Grant award in the amount of $336,652 from the National Science Foundation (NSF) STEM Education program (CFDA 47.076) will support a three-year interdisciplinary research experience for undergraduate (REU) site program at the University of Alabama Tuscaloosa. The program, entitled "Interdisciplinary Research to Prepare Students for the Next Era of Domestic Semiconductor Device Fabrication", will introduce undergraduate students to advanced microelectronic and semiconductor...
The University of Maryland, Baltimore County (UMBC) was awarded a $788,625 Project Grant from the National Science Foundation Division of Undergraduate Education on February 1, 2022 to implement and examine the impact of an enhanced Transfer Scholars Program for inclusive computing and engineering education. The grant is funded through the NSF's STEM Education program (CFDA 47.076), which supports the development of the nation's science, technology, engineering and mathematics education...
This National Science Foundation project grant of $384,771 will fund a Research Experiences for Undergraduates site program at the University of Tennessee from April 2022 through March 2025. The site program will support 10 undergraduate students in 10-week research projects related to microelectronics and sensor systems under the guidance of electrical engineering and computer science faculty mentors. Students will gain hands-on experience using state-of-the-art software and instrumentation...
This Project Grant award from the National Science Foundation (NSF) Computer and Information Science and Engineering (CISE) program, CFDA 47.070, provides $310,000 to the University of Maryland, College Park to develop an innovative training program for the materials science research community that relies on advanced microscopes. The project, titled "COLLABORATIVE RESEARCH: CYBERTRAINING: IMPLEMENTATION: MEDIUM: CYBERINFRASTRUCTURE TRAINING AND EDUCATION FOR LEVERAGING ADVANCED ELECTRON...
This $238,225 Cooperative Agreement award from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program supports the "BEGINNINGS: DEMOCRATIZING RESEARCH AND EXPERIENTIAL EDUCATION FOR MICROELECTRONICS" project. The University of Maryland, College Park (UMD) is partnering with two regional community colleges (College of Southern Maryland and Montgomery College) and industry partners to create an 8-month experiential learning program for second-year community college students in electrical engineering. The program will provide hands-on research projects with UMD faculty, a 3-week practical workshop, and summer internships with industry to develop critical technical skills and career opportunities in emerging microelectronics technologies like biosensors, neuromorphic circuits, and machine learning. The project aims to expand the pool of diverse, research- and industry-ready students to meet the growing demand for a strong domestic microelectronics workforce. No sub-awards are planned under this grant, which runs from October 1, 2023 through September 30, 2026.