Cooperative Agreement 2347109

Award Date 7/15/24
Completion Date 6/30/27
Dollars Obligated $1M
Federal Grant Program
47.084
Assistance Type
Cooperative Agreement
Place of Performance
Boise, ID 83725, USA
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This Cooperative Agreement award of $1,000,000 from the National Science Foundation (NSF) Technology, Innovation, and Partnerships (TIP) program (CFDA 47.084) aims to expand and diversify the semiconductor workforce by recruiting current college students, primarily first-year students, into engineering programs and career pathways within the semiconductor industry. The project, led by Boise State University, will transform degree pathways through a partnership with the College of Southern Idaho (CSI). Key components include:

  1. Offering a new Materials Science and Engineering course (MSE 101) and modules highlighting the semiconductor industry as part of the general education curriculum at CSI to serve as a recruiting mechanism.

  2. Providing equitable access to industry-relevant experiential learning opportunities, such as internships and research projects, to a broader group of students.

  3. Addressing system barriers around program inflexibility, lack of experiential learning, and socioeconomic challenges that may prevent student participation.

The award date is July 15, 2024, with an ultimate completion date of June 30, 2027. CSI will be a sub-grantee, responsible for adopting the new MSE 101 course and incorporating the semiconductor industry modules into its general education curriculum.

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