The applied engineering and technology directorate (aetd), electrical engineering division (EED), code 564, extreme environment electronics, effort requires microchip test structures fabricated in the…
Ended Purchase Order Awarded Last action
- Contract number
- NNG07LH51P
- Awardee
-
Psemi Corp UEI FKNMMNPP6LE4
- Awarding agency
-
Goddard Space Center
National Aeronautics and Space Administration
- Obligated
- $40,000
Award facts
- Contract value 100% obligated
- $40,000.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 334413 Semiconductor and Related Device Manufacturing
- PSC
- AR42 R&D- Space: Operations, Tracking And Data Acquisition (Applied Research/Exploratory Development)
- Set-aside
- No set-aside
- Competition
- Not Competed under SAP · 1 offer Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- San Diego, CA 92121, USA
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Other Administrative Action | $0 | |
| Other Administrative Action | $0 | |
| Original award | $40,000 |
Description
The applied engineering and technology directorate (aetd), electrical engineering division (EED), code 564, extreme environment electronics, effort requires microchip test structures fabricated in the PE foundry radiation hardeneted 0.5U FC process. The required microchips from this specific foundry is because (1) the proven compatibility with stringent space requirements for radiation tolerance and temperature, (2) the process design kit is currently in hand and can be used free of additional unplanned cost, and (3) projected milestones which require that the test structures are fabricated in the PE process in order to confirm test results acquired during earlier testing and develop a low temperature model for this specific process. Peregrine will fabricate masks and wafers on peregrine's ultracmos 0.5UM FC process. The microchips shall be fabricated, 3MM x 3MM with a unique SOS 0.5U FC fabrication process that is radiation hardened, which yields "immunity by process" as opposed to "immunity by design". There shall also be provided, fifty (50) unprobed dice of the submitted chip design. The PE has a fabrication process that has cold temperature immunity. The PE process radiation immunity and proven cold temperature operability are essential characteristics for microchips to be used in space applications.
Quick answers
Who was awarded contract NNG07LH51P?
NNG07LH51P was awarded to Psemi Corp by Goddard Space Center (National Aeronautics and Space Administration) on July 26, 2007.
How much is contract NNG07LH51P worth?
The government has obligated $40,000 on NNG07LH51P.
Was contract NNG07LH51P competed?
The extent of competition for NNG07LH51P was not competed under sap. The government received 1 offer.
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