Circuit card assemb

Ended Awarded

Contract number
SPE7M425F1058
Awardee
Awarding agency
Obligated
$54,980

Award facts

Contract value 100% obligated
$54,980.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
NAICS code
334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
PSC
5998 Electrical And Electronic Assemblies, Boards, Cards, And Associated Hardware
Set-aside
No set-aside
Competition
Competed under SAP Simplified Acquisition
Pricing
Firm Fixed Price
Place of performance
North Springfield, VA 22151, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

About this award

This is a federal delivery order contract awarded by the Defense Logistics Agency Land and Maritime to Cornet Technology, Inc., a minority-owned, for-profit manufacturer based in North Springfield, Virginia. The contract is for the delivery of circuit card assemblies, with a ceiling value of $54,980.00 and a performance period ending on June 11, 2025. Cornet Technology, Inc. is a prime contractor that also holds multiple Indefinite Delivery Contracts (IDVs) with the Defense Logistics Agency, primarily for the procurement of power supplies, circuit card assemblies, and related electronic components to support the U.S. Armed Forces. The company has an extensive history of providing a diverse range of electronic components and services through federal contract awards, and serves as both a prime contractor and subcontractor to major defense contractors.

Quick answers

Who was awarded contract SPE7M425F1058?

SPE7M425F1058 was awarded to Cornet Technology, Inc. by Land and Maritime (Defense Logistics Agency) on March 13, 2025.

How much is contract SPE7M425F1058 worth?

The government has obligated $54,980 on SPE7M425F1058.

Is contract SPE7M425F1058 an order under another contract?

Yes. SPE7M425F1058 is a delivery order under SPE7M524D60FW, an indefinite delivery contract.

Was contract SPE7M425F1058 competed?

The extent of competition for SPE7M425F1058 was competed under sap.

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