Circuit card assemb
Ended Awarded
- Contract number
- SPE7M425F0098
- Awardee
-
Cornet Technology, Inc. UEI P4NMA2SHLR53
- Awarding agency
-
Land and Maritime
Defense Logistics Agency, Department of Defense
- Obligated
- $43,984
Award facts
- Contract value 100% obligated
- $43,984.00 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- NAICS code
- 334418 Printed Circuit Assembly (Electronic Assembly) Manufacturing
- Set-aside
- No set-aside
- Competition
- Competed under SAP Simplified Acquisition
- Pricing
- Firm Fixed Price
- Place of performance
- North Springfield, VA 22151, USA
- Legislative mandates
-
- Walsh-Healey Public Contracts Act FAR subpart 22.6
Award details come from SAM.gov/FPDS.
About this award
This is a firm fixed-price delivery order awarded to Cornet Technology, Inc., a minority-owned, for-profit manufacturer of C4ISR solutions and deployable military communication equipment. The $43,984 order was placed by the Defense Logistics Agency (DLA) Land and Maritime under an indefinite delivery contract for the procurement of circuit card assemblies to support the U.S. Armed Forces' global supply chain operations. Cornet Technology has extensive experience as both a prime contractor and subcontractor on numerous federal contracts with DLA, the Department of the Navy, and the Department of the Air Force, providing a wide range of electronic components, equipment, and services. This award does not have a set-aside designation.
Quick answers
Who was awarded contract SPE7M425F0098?
SPE7M425F0098 was awarded to Cornet Technology, Inc. by Land and Maritime (Defense Logistics Agency) on October 17, 2024.
How much is contract SPE7M425F0098 worth?
The government has obligated $43,984 on SPE7M425F0098.
Is contract SPE7M425F0098 an order under another contract?
Yes. SPE7M425F0098 is a delivery order under SPE7M524D60FW, an indefinite delivery contract.
Was contract SPE7M425F0098 competed?
The extent of competition for SPE7M425F0098 was competed under sap.
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