Support for DARPA system on a chip (SOC) design methodology. The goal of this project is to understand the challenges inherent in integrating scalable security into the automated chip design…
Ended Awarded Last action
- Contract number
- HR001119F0026
- Awardee
-
University Of Maryland, College Park UEI NPU8ULVAAS23 Part of University System Of Maryland
- Awarding agency
-
Defense Advanced Research Projects Agency
Department of Defense
- Obligated
- $2,118,902
Award facts
- Opportunity
-
- J&A: ARLIS IDIQ Ceiling Price Increase Limited / Sole Source Justification · Posted Apr 27, 2021
- Contract value 100% obligated
- $2,118,902.04 Current and potential, with all options
- Completion date 100% complete
- Current and potential, with all options
- Contracting staff
- NAICS code
- 611310 Colleges, Universities, and Professional Schools
- PSC
- R499 Support- Professional: Other
- Set-aside
- No set-aside
- Competition
- Not Competed Only One Source
- Pricing
- Cost Plus Fixed Fee
- Place of performance
- College Park, MD 20742, USA
- Legislative mandates
-
- Employment Eligibility Verification (E-Verify) FAR subpart 22.18
Award details come from SAM.gov/FPDS.
Transactions
| Action | Obligated | Date |
|---|---|---|
| Supplemental Agreement for work within scope | -$123,640 | |
| Supplemental Agreement for work within scope | $815,537 | |
| Funding Only Action | $400,000 | |
| Supplemental Agreement for work within scope | $415,957 | |
| Funding Only Action | $511,048 | |
| Original award | $100,000 |
About this award
The Defense Advanced Research Projects Agency (DARPA) awarded a $2,118,902.04 cost-plus-fixed-fee delivery order to the University of Maryland, College Park to support research into integrating scalable security into the automated chip design process, with a focus on system-on-a-chip (SoC) designs. This research aims to understand the challenges of incorporating security measures into the SoC design flow or associated metrics. The award, which has a completion date of February 11, 2022, was issued on February 12, 2019 and did not utilize a set-aside designation. The University of Maryland, College Park, which is part of the University System of Maryland, has extensive experience conducting research and providing services to federal agencies, including the Department of Defense, NASA, and others.
Description
Support for DARPA system on a chip (SOC) design methodology. The goal of this project is to understand the challenges inherent in integrating scalable security into the automated chip design process, with a specific focus on system on a chip (SOC) designs and the impact to the flow or metrics.
Quick answers
Who was awarded contract HR001119F0026?
HR001119F0026 was awarded to University Of Maryland, College Park by Defense Advanced Research Projects Agency (Department of Defense) on February 12, 2019.
How much is contract HR001119F0026 worth?
The government has obligated $2,118,902 on HR001119F0026.
Is contract HR001119F0026 an order under another contract?
Yes. HR001119F0026 is a delivery order under HQ003418D0005, an indefinite delivery contract.
Was contract HR001119F0026 competed?
The extent of competition for HR001119F0026 was not competed.
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