Support for DARPA system on a chip (SOC) design methodology. The goal of this project is to understand the challenges inherent in integrating scalable security into the automated chip design…

Ended Awarded Last action

Contract number
HR001119F0026
Awardee
Awarding agency
Obligated
$2,118,902

Award facts

Opportunity
Contract value 100% obligated
$2,118,902.04 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Contracting staff
Set-aside
No set-aside
Competition
Not Competed Only One Source
Pricing
Cost Plus Fixed Fee
Place of performance
College Park, MD 20742, USA
Legislative mandates

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Supplemental Agreement for work within scope P00005 · Secure system on chip (SCO) methodology support -$123,640
Supplemental Agreement for work within scope P00004 · Secure system on chip (SOC) methodology support $815,537
Funding Only Action P00003 · Secure SOC methodology labor support $400,000
Supplemental Agreement for work within scope P00002 · Secure system on a chip (SOC) design methodology $415,957
Funding Only Action P00001 $511,048
Original award $100,000

About this award

The Defense Advanced Research Projects Agency (DARPA) awarded a $2,118,902.04 cost-plus-fixed-fee delivery order to the University of Maryland, College Park to support research into integrating scalable security into the automated chip design process, with a focus on system-on-a-chip (SoC) designs. This research aims to understand the challenges of incorporating security measures into the SoC design flow or associated metrics. The award, which has a completion date of February 11, 2022, was issued on February 12, 2019 and did not utilize a set-aside designation. The University of Maryland, College Park, which is part of the University System of Maryland, has extensive experience conducting research and providing services to federal agencies, including the Department of Defense, NASA, and others.

Description

Support for DARPA system on a chip (SOC) design methodology. The goal of this project is to understand the challenges inherent in integrating scalable security into the automated chip design process, with a specific focus on system on a chip (SOC) designs and the impact to the flow or metrics.

Quick answers

Who was awarded contract HR001119F0026?

HR001119F0026 was awarded to University Of Maryland, College Park by Defense Advanced Research Projects Agency (Department of Defense) on February 12, 2019.

How much is contract HR001119F0026 worth?

The government has obligated $2,118,902 on HR001119F0026.

Is contract HR001119F0026 an order under another contract?

Yes. HR001119F0026 is a delivery order under HQ003418D0005, an indefinite delivery contract.

Was contract HR001119F0026 competed?

The extent of competition for HR001119F0026 was not competed.

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