Defense advanced research projects agency (DARPA) small business innovation research (sbir) phase II effort for statement of work entitled, "SIC cmos integrated-circuit high-temperature sensing…

Ended Definitive Contract Awarded Last action

Contract number
W31P4Q21C0008
Awardee
Awarding agency
Obligated
$1,499,989

Award facts

Contract value 100% obligated
$1,499,989.00 Current and potential, with all options
Completion date 100% complete
Current and potential, with all options
Funding agency
Defense Advanced Research Projects Agency Department of Defense
Set-aside
Total Small Business
Competition
Full and Open Competition after exclusion of sources · 33 offers Negotiated Proposal / Quote
Pricing
Cost Plus Fixed Fee
Place of performance
Takoma Park, MD 20912, USA
Research
SBIR Program Phase II Action

Award details come from SAM.gov/FPDS.

Transactions

Action Obligated Date
Supplemental Agreement for work within scope P00007 $0
Other Administrative Action P00006 · This modification P00006 is for a no cost extension to contract W31P4Q-21-c-0008. $0
Supplemental Agreement for work within scope P00005 $0
Exercise an Option P00004 $499,997
Supplemental Agreement for work within scope P00003 $0
Supplemental Agreement for work within scope P00002 · NCE on slin 0001AA only - DARPA sbir phase II effort for statement of work entitled, "SIC cmos integrated-circuit high- temperature sensing platform with… $0
Supplemental Agreement for work within scope P00001 · 2ND incremental funding - DARPA sbir phase II effort for statement of work entitled, "SIC cmos integrated-circuit high-temperature sensing platform with… $499,992
Original award $500,000

About this award

This is a $1,499,989.00 cost-plus-fixed-fee SBIR Phase II contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Coolcad Electronics, Inc., a small business, for the development of a silicon carbide (SiC) CMOS integrated circuit high-temperature sensing platform with enhanced gate oxide reliability. The contract supports the statement of work "SiC CMOS Integrated-Circuit High-Temperature Sensing Platform with Enhanced Gate Oxide Reliability" and has a period of performance through June 30, 2025. As a Small Business Innovation Research (SBIR) Phase II effort, this contract builds upon prior exploratory research conducted under a Phase I award. Coolcad Electronics is a small, for-profit semiconductor technology company focused on advanced materials like SiC and gallium nitride (GaN) for power electronics, integrated circuits, and specialized components across defense, aerospace, and energy applications.

Description

Defense advanced research projects agency (DARPA) small business innovation research (sbir) phase II effort for statement of work entitled, "SIC cmos integrated-circuit high-temperature sensing platform with enhanced gate oxide reliability"

Quick answers

Who was awarded contract W31P4Q21C0008?

W31P4Q21C0008 was awarded to Coolcad Electronics, Inc. by Aviation and Missile Command (Army Materiel Command) on February 1, 2021.

How much is contract W31P4Q21C0008 worth?

The government has obligated $1,499,989 on W31P4Q21C0008.

Which agency awarded contract W31P4Q21C0008?

Aviation and Missile Command (Army Materiel Command) awarded W31P4Q21C0008, with funding from Defense Advanced Research Projects Agency (Department of Defense).

Was contract W31P4Q21C0008 competed?

The extent of competition for W31P4Q21C0008 was full and open competition after exclusion of sources. The government received 33 offers. It was set aside: Total Small Business.

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