This $14,866,765.00 definitive, cost-plus-fixed-fee contract was awarded by the Defense Advanced Research Projects Agency (DARPA) to Raytheon Company to develop technologies for the Technologies for Heat Removal in Electronics at the Device Scale (THREADS) program. The contract has no set-aside designation. Under the THREADS program, Raytheon and its subcontractors University of Maryland, College Park, Michigan State University, Cornell University, IQE KC, LLC, and Coherent Aerospace & Defense, Inc. will work to demonstrate an 8x reduction in transistor thermal resistance and 81 W/mm output power density. This effort aims to overcome thermal limitations and realize high-power density transistors approaching their fundamental electronic limit for radio frequency applications. The contract has an ultimate completion date of September 28, 2027.
Generated 9/27/24, 9:05 AM