This is a $12,676,837 definitive contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Lockheed Martin Corporation. The purpose of the contract is to demonstrate the ability of a chiplet design approach to meet DARPA's CHIPS program objectives of a modular, lower cost, lower risk, and more flexible integrated circuit design and fabrication approach. The contract is a cost-plus-fixed-fee arrangement with no set-aside designation. As the prime contractor, Lockheed Martin has engaged several subcontractors including Ami Semiconductor, Intrinsix Corp, Palo Alto Research Center LLC, and New Wave Design & Verification LLC to provide a range of semiconductor design, development, and verification services in support of the CHIPS program goals.
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