Definitive Contract HR001117C0090

Award Date 8/22/17
Potential Completion Date 12/31/19
Potential Value $13M
Ultimate Awardee
Not listed
Federal Contract Vehicle
Set-Aside Type
No Set-Aside Used
Extent Competed
Full and Open Competition
Major Defense Program
Not listed
Pricing Type
Cost Plus Fixed Fee
Place of Performance
Cherry Hill, NJ 08002, USA
Solicitation Procedures
Basic Research
Number Of Offers Received
43
Legislative Mandate
Not listed
National Interest Action
Not listed
Research Type
Not listed
Primary Consortia Member
Not listed

This is a $12,676,837 definitive contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Lockheed Martin Corporation. The purpose of the contract is to demonstrate the ability of a chiplet design approach to meet DARPA's CHIPS program objectives of a modular, lower cost, lower risk, and more flexible integrated circuit design and fabrication approach. The contract is a cost-plus-fixed-fee arrangement with no set-aside designation. As the prime contractor, Lockheed Martin has engaged several subcontractors including Ami Semiconductor, Intrinsix Corp, Palo Alto Research Center LLC, and New Wave Design & Verification LLC to provide a range of semiconductor design, development, and verification services in support of the CHIPS program goals.

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