Definitive Contract HR001111C0059

The Defense Advanced Research Projects Agency (DARPA) awarded a $5,293,470 cost-plus-fixed-fee contract to BAE Systems Information and Electronic Systems Integration Inc. to develop the technology needed to determine if integrated circuits (ICs) have been maliciously modified and to assess an IC's useful lifespan. This contract, known as the Integrity and Reliability of Integrated Circuits (IRIS) program, does not have a set-aside designation. BAE Systems' FAST Labs-Advanced Information...

This is a $690,871 definitive contract awarded by the Defense Advanced Research Projects Agency (DARPA) to the University of Southern California (USC) for the Integrity and Reliability of Integrated Circuits (IRIS) Phase III program. The contract, which does not have a set-aside designation, will investigate the acceleration of stress-induced degradation of advanced complementary metal-oxide-semiconductor (CMOS) technology nodes. USC has subcontracted a portion of the work to Arizona State...

This $4,407,038.00 cost-plus-fixed-fee contract was awarded by the Defense Advanced Research Projects Agency (DARPA) to The Boeing Company for the Integrity and Reliability of Integrated Circuits (IRIS) Phase 3 program. The contract, which does not have a set-aside designation, will investigate the effects of extreme physical stresses on wear-out and aging mechanisms in CMOS components at the 28nm and/or 14nm lithography nodes. The program aims to create predictive models and test the...

This is a $2,999,409.00 definitive contract awarded by the Defense Advanced Research Projects Agency (DARPA) to International Business Machines Corporation (IBM) for the "Integrity and Reliability of Integrated Circuits (IRIS) Phase III - Subphase A" program. The contract aims to develop methods to rapidly and controllably degrade circuits without introducing unintended physical defects, and to identify the cause of failure of degraded circuits to determine their lifetime at...

This federal contract award, valued at $1,999,779.00, was issued by the Defense Advanced Research Projects Agency (DARPA) to SRI International, a non-profit research institute. The contract is for the "INTEGRITY AND RELIABILITY OF INTEGRATED CIRCUITS (IRIS) FOLLOW-ON PHASE 3" and does not have a small business set-aside designation. As a prime contractor, SRI International is leading the effort to develop advanced capabilities related to integrated circuits and electronics. Major...

This is a definitive, cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Intrinsix Corp., doing business as Intrinsix, a for-profit organization that provides ASIC design services. The $1,586,143.00 contract is for the verification of integrated circuit (IC) foundation intellectual property (IP) and a processor. The contract does not have a set-aside designation. In addition to this award, Intrinsix has received other DARPA contracts, including a...

Indiana Integrated Circuits LLC, doing business as IIC, has been awarded a $849,795.98 firm fixed price definitive contract by the Department of the Air Force Materiel Command Research Laboratory to conduct research on adiabatic circuits for ultra-low energy consumption. This contract is associated with the Small Business Technology Transfer program's Phase II funding vehicle and has a total small business set aside designation. Under this award, IIC will develop adiabatic circuit technologies...

Iris Technology Corporation was awarded a $1,730,000 cost-plus-fixed-fee definitive contract by the Department of the Air Force Materiel Command Research Laboratory for the SBIR Program Phase II Action titled "Cislunar Space Domain Awareness Sensor." As a total small business set aside, this contract supports the continued research and development of space domain awareness sensors through Iris Technology Corporation's facility in Irvine, California, with a period of performance through...

This is a $238,458 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Ozark Integrated Circuits Inc., a small business specializing in custom analog and mixed-signal integrated circuits and microelectronics for extreme environments. The contract is for the packaging and testing of lateral SiC integrated circuits capable of operating at 800°C, which has applications in areas such as space exploration, hypersonic systems, directed energy weapons, and...

This is a $5,358,861 cost-plus-fixed-fee contract awarded by the Defense Advanced Research Projects Agency (DARPA) to Intrinsix Corp., a for-profit electronics design services firm, to provide integrated circuits in the form of single-function chiplets to support DARPA's CHIPS platform. The contract, which does not have a set-aside designation, was awarded on September 14, 2017 and is scheduled for completion on September 13, 2020. Intrinsix has previously received SBIR awards from DARPA for...